基于聚氨酯丙烯酸酯（PUA）的微纳米转印技术研究

发布时间：2017-12-28 22:26

本文关键词：基于聚氨酯丙烯酸酯（PUA）的微纳米转印技术研究　出处：《合肥工业大学》2016年硕士论文　论文类型：学位论文

【摘要】：微纳米转印技术作为非传统微纳米加工技术,已广泛地用于制备微光电器件,如：太阳能电池电极,发电二极管,光伏转换单元等。本文利用聚合物材料聚氨酯丙烯酸酯(PUA)与聚甲基丙烯酸甲酯(PMMA),制备周期性的微纳米双层胶结构,并阐明了PUA的微纳米转印机理。该技术为微纳米转印技术的研究和应用提供了必要的理论指导。通过聚二甲基硅烷(PDMS)图章沟槽的毛细作用力在PDMS软印章中制备PUA图形,结合紫外固化技术将PUA图形转移到PMMA基底上,通过反应离子刻蚀(RIE),得到具有内切结构的PUA掩膜,在其表面上镀金并用丙酮去除底胶获得具有周期性的微纳米结构图形。由于PDMS图章能够吸收PUA小分子,实验成功制备了无残胶的双层胶结构；PUA具有很强的抗氧气刻蚀性,有利于形成良好的内切结构。通过PUA/PMMA双层胶转印技术成功制备了微纳米线阵,针对微纳米点阵结构,在去胶之后利用金属辅助湿法刻蚀技术在硅片上制备出了微纳米点阵。将PUA作为墨水材料,利用墨水转印技术在耐高温聚酯(PET)柔性模板上制作微纳米图形结构。通过对墨水转印的三个关键因素：墨水材料填充情况、材料间粘附能大小以及柔性模板揭离过程中的动力学进行分析,得出了复制模板失败的原因所在。利用有限元模拟软件Fluent模拟分析,得出PUA能够完全填充具有点阵结构的硅模板：建立了微结构模板、PUA、基底在转印过程中的物理模型,通过具体的粘附能公式计算得出：由于模板与PUA的粘附能与PUA与基底的粘附能之比大于临界值C,所以导致了转印的失败。通过利用natlab软件绘制关于材料间粘附能比值与临界值C的曲线,分析得出了通过改进模板上微纳米结构尺寸的解决办法。
[Abstract]:As a non-traditional micro nano processing technology, micro and nano transfer technology has been widely used in the manufacture of low light electrical devices, such as solar cell electrodes, power generation diodes, photovoltaic conversion units, etc. In this paper, the periodic micro / nano bilayer structure was prepared by using polymer material polyurethane acrylate (PUA) and polymethyl methacrylate (PMMA), and the mechanism of micro and nano PUA transfer was elucidated. The technology provides the necessary theoretical guidance for the research and application of micro - Nano transfer technology. The poly two methyl silane (PDMS) capillary force stamp groove preparation of PUA graphics in PDMS soft seal, combined with UV curing technology of PUA graphics transfer to PMMA substrate by reactive ion etching (RIE), has been inscribed structure of the PUA mask on the surface of gold plating and micro nano structure graphics with periodic removal of adhesive obtained by acetone. Because the PDMS stamp can absorb PUA small molecules, we have successfully prepared the double-layer adhesive structure without residual glue. PUA has strong anti oxygen etching ability, and is conducive to the formation of good inner cut structure. The micro nanowire arrays were successfully fabricated by PUA/PMMA double layer transfer printing technology. Micro nano dot arrays were fabricated on silicon wafers by metal assisted wet etching technology for micro and nano dot arrays. PUA is used as ink material, and the micro - nano structure is made on high temperature resistant polyester (PET) flexible template by using ink transfer technology. By analyzing the three key factors of ink transfer, the filling condition of ink material, the adhesive energy between materials and the dynamics in the process of separating the flexible template, the reason for the failure of replication template is obtained. By using the finite element simulation software Fluent simulation analysis, get the conclusion that PUA can completely fill the silicon template with a lattice structure: a physical model of micro structure template, PUA, substrate in the transfer process, through specific adhesion to formula: as the template and PUA adhesion with the substrate and the adhesion of PUA to a ratio of more than the critical value of C, resulting in the failure of the transfer. The curve of adhesion energy ratio and critical value C between materials is drawn by using natlab software. The solution to improve the size of micro and nano structure on the template is obtained through analysis.
【学位授予单位】：合肥工业大学
【学位级别】：硕士
【学位授予年份】：2016
【分类号】：TQ317;TB383.1

【相似文献】