小靶大基片镀膜的膜厚均匀性分析

发布时间：2018-01-04 11:43

本文关键词：小靶大基片镀膜的膜厚均匀性分析　出处：《表面技术》2017年02期 　论文类型：期刊论文

【摘要】：目的通过改变传统基片与靶材的相对运动方式,来实现小靶材在大面积基片上的均匀镀膜。方法采用基片绕中心轴做匀速旋转运动,靶材沿着基片半径做直线间歇运动,并建立了相应的理论模型,通过数值分析软件MATLAB对膜厚进行分析拟合,研究靶基距、偏心距、靶材运动方式对膜层均匀度的影响。结果在靶基距H=30 mm时,膜厚均匀性主要受到两个重要参数的影响:靶材在各径向运动等距点的停顿时间T和移动步长d。与靶材在各径向运动等距点的停顿时间T=C(C为常数)的情况相比,当靶材的停顿时间T与其在基片上的覆盖面积A成正比增加时,膜厚的均匀性得到极大的改善。同时,膜厚的均匀性很大程度上取决于靶材的移动步长,膜层之间的差异性随着移动步长的减小而减小,结果显示当移动步长d=5mm时的膜厚均匀性最佳。改善基片中心附近的膜厚分布可以通过增加靶基距来实现,结果显示在偏心距e=0 mm、靶基距H≥70 mm时,膜厚相对偏差δ均小于0.1。结论该方法改变了传统靶材固定不动的方式,在薄膜沉积过程中,通过调节靶材的移动步长和停顿时间,能有效减小膜层之间的差异,从而获得均匀度较高的薄膜,对实际生产具有指导意义。
[Abstract]:To change the traditional way through the relative movement of the substrate and the target, to achieve small target in large area uniform coating on the substrate. The substrate around the center axis of uniform rotation motion, the target of the substrate radius of linear intermittent movement, and set up a theoretical model, through the numerical analysis software of MATLAB film thickness were analyzed, research target substrate distance, eccentricity, influence of target movement uniformity on the film. The results in the target substrate distance H=30 mm. The influence of film thickness uniformity are two important parameters: the target in the radial movement from the point of pause time T and mobile D. and target in step the radial motion of equidistant pause time T=C (C constant) compared to the case when the pause time of T target and in the substrate on the A coverage area is proportional to the increase, the uniformity of film thickness has been greatly improved. At the same time, the average film thickness Uniformity depends largely on the target moving step, the difference between film layers decreases with the moving step, the results show that when the moving step d=5mm when the film thickness uniformity. The best improvement near the center of the substrate thickness can be increased by the target substrate distance to achieve results in the eccentricity e=0 mm H, target substrate distance greater than 70 mm when the film thickness is less than 0.1.. The relative deviation of conclusion this method has changed the traditional way of target fixed, in the film deposition process, by adjusting the target moving step and the pause time, can effectively reduce the differences between film layers and thin films can be obtained more uniform, with guiding significance for the actual production.

【作者单位】：陕西科技大学机电工程学院;
【分类号】：TB383.2
【正文快照】： Received:2016-07-14;Revised:2016-10-15在真空镀膜中,膜厚的均匀性直接影响镀膜设备的性能,一般情况下都要求镀膜面内的膜厚分布尽可能均匀一致,即薄膜具有较好的均匀性[1]。针对磁控溅射镀膜而言,其具有较高的沉积速度、较低的制造成本以及适用于难熔金属以及化合物等优点,

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