一种化学还原镀金液复合配位剂的研究

发布时间：2018-01-06 16:46

本文关键词：一种化学还原镀金液复合配位剂的研究　出处：《表面技术》2017年06期 　论文类型：期刊论文

【摘要】：目的研究由乙二胺四乙酸二钠(EDTA-2Na)、乙二胺四亚甲基膦钠(EDTMPS)和柠檬酸三铵(C_6H_5O_7(NH_4)_3)组成的复合配位剂,在不同浓度及pH下,对金沉积速率、镀金液稳定性、金镀层结构及性能的影响。方法用化学镀的方法在树脂基体上先预镀覆Cu-Ni-Pd金属层,然后制备金镀层。采用正交实验法,研究复合配位剂浓度及pH对金层沉积速率、镀金液稳定性、结合力、光亮度的影响。借助扫描电镜及能谱,分析不同优化组合镀液配方制备的镀层形貌及成分。结果以镀金沉积速率为评价指标时的最优组合为A_2C_3D_3B_2,以镀液稳定性为评价指标时的最优组合为A_2C_2B_3D_2,以镀层结合力为评价指标时的最优组合为A_2D_2B_2C_2,以镀层光亮度为评价指标时的最优组合为A_3C_1D_2B_2。将4个单一评价指标的最优组合重复实验,实验结果表明,当EDTA-2Na为15 g/L、EDTMPS为3 g/L、C_6H_5O_7(NH_4)_3为30 g/L、pH为6.0时,镀液稳定性最高,可达6 MTO;镀层沉积速率最快,可达0.0066μm/min;镀层结合力可达5级,光亮度可达1级。结论采用EDTA-2Na、EDTMPS和C_6H_5O_7(NH_4)_3组成的复合配位剂,在适当的pH下能够提高镀层沉积速度及镀液稳定性,改善镀层表面形貌。
[Abstract]:Objective to study the content of EDTA-2Na by EDTA-2Na2 (ethylenediamine tetraacetate disodium). The complex coordination agent composed of ethylenediamine tetramethylene phosphine sodium (EDTMPS) and triammonium citrate C6H _ 5O _ (7NH _ 4 / T _ 3) was used to deposit gold at different concentration and pH. Methods Cu-Ni-Pd metal coating was precoated on resin substrate by electroless plating, and then gold coating was prepared. Orthogonal experiment was used. The effects of the concentration and pH of complex coordination agent on the deposition rate, stability, binding force and luminance of gold plating bath were studied by means of scanning electron microscopy and energy dispersive spectroscopy. The morphology and composition of the coating prepared by different optimized combination of plating bath formulations were analyzed. Results the optimum combination of A2C3D\ +\ +\\ -\\\. When the stability of plating solution is taken as the evaluation index, the optimal combination is A _ 2C _ s _ 2B _ 3D _ _ _. The optimal combination of the coating luminance as the evaluation index is A3CSTS 1D2BSP 2.The experiment of the optimal combination of the four single evaluation indexes is repeated, and the experimental results show that. When the EDTA-2Na is 15 g / L, EDTMPS is 3 g / L, the number is 3 g / L, the number is 30 g / L, the pH is 6.0. The stability of plating solution is the highest, up to 6 MTO; The deposition rate of the coating is the fastest, up to 0.0066 渭 m / min; Conclusion the composite coordination agent composed of EDTA-2NaNa-EDTMPS and C6H _ 5O _ 5O _ 7C _ 6H _ 5O _ 7 / C _ 6H _ 5O _ 7 / C _ 6H _ 5O _ 7 / C _ 6H _ 5O _ 7 / C _ 6H _ 5O _ 7 / C _ 6H _ 5O. The deposition rate and the stability of the plating solution can be improved at proper pH, and the surface morphology of the coating can be improved.
【作者单位】：长沙理工大学化学与生物工程学院;
【基金】：国家自然科学基金(31527803,21501015,21545010) 湖南省战略性新兴产业科技攻关与重大成果转化项目(2015GK1046)~~
【分类号】：TB306
【正文快照】： Received:2017-02-22;Revised:2017-04-12(School of Chemistry and Biological Engineering,Changsha University of Science and Technology,Changsha 410114,China)随着电子产品更新换代的加快,印刷电路板朝传载信息更快、体积更小、更轻量级发展,对印刷电路板表面处理工艺

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