石墨烯含量对铜基石墨烯复合材料力学和电学性能的影响

发布时间：2018-01-11 03:04

本文关键词：石墨烯含量对铜基石墨烯复合材料力学和电学性能的影响　出处：《材料导报》2017年S1期 　论文类型：期刊论文

【摘要】：为改进铜基复合材料的力学和电学性能,向铜基体分别加入0.2%、0.3%、0.4%(质量分数)的石墨烯,充分混合后,采用放电等离子烧结技术(SPS)制备了石墨烯/铜(G/Cu)复合材料。通过扫描电镜(SEM)、拉曼(Raman)光谱和XRD等表征了复合材料微观结构,测试了其硬度、屈服强度、抗压强度和导电率等性能,以确定石墨烯在铜基体中的合适掺杂量。结果表明:随着石墨烯含量的降低,其力电性能显著提高。当石墨烯质量分数为0.2%时,G/Cu复合材料的综合性能(力学及电学性能)达到最好匹配,实现了铜基材料的高强度、高导电性:其抗压强度和屈服强度分别为557.23 MPa和256 MPa,相对于用SPS方法制备的纯铜分别提高了59.21%和70.7%;电导率为52.3 MS/m,其IACS高达91.8%。
[Abstract]:In order to improve the mechanical and electrical properties of the copper matrix composites, 0.2and 0.3g graphene were added to the copper matrix, respectively, and were fully mixed. Graphene / copper G / Cu composites were prepared by spark plasma sintering (SPS) technique. The microstructure of the composites was characterized by Raman spectroscopy and XRD. The hardness, yield strength, compressive strength and conductivity of the composites were tested. The results show that the mechanical and electrical properties of graphene increase with the decrease of graphene content, and when the graphene mass fraction is 0.2. The comprehensive properties (mechanical and electrical properties) of the G- / Cu composite are the best match, and the high strength of the copper-base materials is realized. High electrical conductivity: the compressive strength and yield strength were 557.23 MPa and 256MPa, respectively, which increased by 59.21% and 70.7 compared with pure copper prepared by SPS method. The conductivity is 52.3 MS / m, and its IACS is 91.8%.
【作者单位】：昆明理工大学材料科学与工程学院;
【基金】：国家自然科学基金(11564022) 教育部新教师基金(20135314120004);教育部博士点基金(20135314110003) 云南省分析测试中心基金(2016M20152230044)
【分类号】：TB333
【正文快照】： 0引言铜基复合材料因其良好的导电导热和加工性能而在汽车、航空航天和电子领域具有广阔的应用前景[1-3]。随着现代科技的快速发展,铜基复合材料的性能需求越来越高,要求其既有高的导电性,又具有高的强度和硬度。传统的碳纤维[4-5]、碳纳米管[6]和颗粒增强体[7-8]虽然可以提高

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