石墨烯包裹的PMMA微球改性环氧树脂的导热性

发布时间：2018-01-23 04:45

本文关键词： 石墨烯聚甲基丙烯酸甲酯环氧树脂导热率分散　出处：《塑料》2017年03期 　论文类型：期刊论文

【摘要】：利用悬浮聚合法和改进Hummers法分别制得粒径为200~300 nm的聚甲基丙烯酸甲酯(PMMA)微球和氧化石墨烯,再用化学还原方法将氧化石墨烯包裹在PMMA微球上,最后利用氧化石墨烯包裹的PMMA微球对环氧树脂进行改性,制得低氧化石墨烯含量的高导热率环氧树脂复合材料。包裹氧化石墨烯的PMMA微球改性后的环氧树脂复合材料微观形貌测试结果表明,氧化石墨烯包裹的PMMA微球均匀分散在环氧树脂基体中;环氧树脂复合材料的导热性在氧化石墨烯含量为0.1%、0.3%、0.5%、0.7%和1%时,导热率分别由纯环氧树脂的0.19 W/(m·K)提高到0.52、0.99、1.22、1.33和1.42 W/(m·K)。
[Abstract]:PMMA microspheres and graphene oxide were prepared by suspension polymerization and modified Hummers method, respectively. The graphene oxide was encapsulated on PMMA microspheres by chemical reduction method. Finally, the epoxy resin was modified by PMMA microspheres coated with graphene oxide. The high thermal conductivity epoxy resin composites with low graphene oxide content were prepared. The results showed that the morphology of epoxy resin composites modified by PMMA microspheres coated with graphene oxide was measured. PMMA microspheres coated with graphene oxide were uniformly dispersed in epoxy resin matrix. The thermal conductivity of epoxy resin composites is 0. 1% and 0. 5% when the content of graphene oxide is 0. 1% and 0. 5%. The thermal conductivity of the pure epoxy resin was increased from 0.19 W / m 路K to 0.52% 0.99% 1.221.33 and 1.42 W / L 路K ~ (-1), respectively.
【作者单位】：重庆水利电力职业技术学院;西南交通大学电气工程学院;重庆大学输配电装备及系统安全与新技术国家重点实验室;
【基金】：2016年重庆市教委科学技术研究项目(KJ1603601) 2017年重庆市教委科学技术研究项目(KJ1735450)
【分类号】：TB332;TQ323.5
【正文快照】： 由于重量轻、耐化学腐蚀性强和制造成本低等优点,导热型聚合物在高密度电子器件中的应用变得越来越重要。但不经过改性的聚合物导热性普遍不佳,这限制了它们在高密度电子器件中的应用因此,在集成电路不断发展的今天,开发具有高导热性的聚合物基复合材料至关重要。目前研究的热

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