直流脉冲磁控溅射铜膜的结构与性能研究

发布时间：2018-02-02 14:45

本文关键词： 铜膜纳米压痕弹性模量硬度接触刚度　出处：《功能材料》2017年02期 　论文类型：期刊论文

【摘要】：采用直流脉冲磁控溅射法制备铜膜,利用X射线衍射法分析薄膜相结构,通过扫描电镜观察薄膜形貌,基于纳米压痕载荷-位移曲线计算薄膜的硬度、弹性模量和接触刚度,同时采用显微硬度法测量薄膜硬度,系统研究了溅射功率和偏压对铜膜结构和力学性能的影响。结果表明,通过纳米压痕载荷-位移曲线计算薄膜力学性能是可靠的。随着溅射功率的增大,铜膜生长取向几乎无变化,均呈无择优生长状态,弹性模量、接触刚度基本不变,硬度略有减小;偏压增大会使铜膜呈现明显的(111)取向生长,接触刚度、弹性模量和硬度呈下降趋势。
[Abstract]:The copper film was prepared by DC pulse magnetron sputtering. The phase structure of the film was analyzed by X-ray diffraction. The morphology of the film was observed by scanning electron microscope. The hardness, elastic modulus and contact stiffness of the film were calculated based on the load-displacement curve of nano-indentation. The effects of sputtering power and bias voltage on the structure and mechanical properties of copper film were systematically studied. It is reliable to calculate the mechanical properties of the films by nano-indentation load-displacement curves. With the increase of sputtering power, the growth orientation of copper films almost has no change, all of them have no preferential growth state, the elastic modulus and contact stiffness are basically unchanged. The hardness decreases slightly, and the increase of bias makes the copper film grow with obvious orientation, and the contact stiffness, elastic modulus and hardness show a decreasing trend.
【作者单位】：南京工程学院材料工程学院;江苏省先进结构材料与应用技术重点实验室;东南大学材料科学与工程学院;
【基金】：国家自然科学青年基金资助项目(51301087);国家自然科学青年基金资助项目(51201033) 江苏省先进结构材料与应用技术重点实验室开放基金资助项目(ASMA201412) 江苏省大学生实践创新训练计划资助项目(201511276024Z)
【分类号】：O614.121;TB383.2
【正文快照】： 0引言铜膜具有较高的抗电子迁移能力和高的电导率而被广泛应用于集成电路和微电子仪器的互连部分[1]。但铜的弹性模量较高,故铜膜存在的应力较大,则可能会使膜体产生空洞、裂纹或脱落等问题,从而引起集成电路结构的形变以及内连导线短路,造成电子元器件的失败[2]。采用磁控溅

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