纳米碳（钨）铜复合粉末的喷雾干燥法制备及其复合材料研究

发布时间：2018-02-21 19:38

  本文关键词： 钨铜复合材料 CNTs/Cu复合材料 RGO/Cu复合材料 喷雾干燥法 SPS烧结 CIP成型　出处：《湖南大学》2015年硕士论文　论文类型：学位论文

【摘要】：高性能铜基复合材料不仅具备高导电高导热性能,而且拥有较高硬度和强度,同时还具有良好的耐电腐蚀能力,因此被广泛应用于电工电子、军工航天等各个工业部门。本文通过喷雾干燥-煅烧-还原的工艺制备了四类铜基复合粉体,对四类粉体制备了复合材料,通过对复合材料微观结构、成分的表征和硬度、电导率,相对密度等性能的测试,探讨了影响铜基复合材料的因素,得到了一系列制备高性能铜基复合材料的可靠参数。1.以模压成型(MP)、等离子体烧结(SPS)和冷等静压成型(CIP)制备了高铜含量钨铜复合材料(15WCu和20WCu)。性能测试结果表明,MP成型15WCu和20WCu复合材料烧结最佳温度均在1130℃;SPS烧结中,15WCu和20WCu复合材料在700℃温度下烧结时性能最好,最佳烧结时间分别是10min和15min;比较三种工艺,SPS烧结样品性能与CIP样品相当,MP成型样品性能次之。两种钨铜复合材料比较而言,15WCu样性能将优于20WCu样。其原因是15WCu样中铜含量较高,形成铜网络密度较大,导电率较高,而20WCu中钨含量较高,烧结中发生聚沉,致使复合材料致密度和硬度下降。2.以MP成型和CIP成型方法制备了CNTs/Cu复合材料。研究结果表明,随着CNTs含量的增加,CNTs/Cu复合材料显微硬度有了很大提高,而电导率和致密度均有所下降,但下降不大,在含量为0.5wt%时综合性能最佳。比较两种成型工艺对复合材料的性能的影响,结果显示冷等静压成型优于模压工艺。对CNTs含量为0.5wt%的冷等静压复合材料进行热性能测试,结果显示复合材料电导率在高达87.26%IACS的情况下,材料硬度和热导率分别达到了105.24HV、407.84W/(m·K)。3.利用MP和SPS两种方法成功制备了RGO/Cu复合材料,采用SPS烧结制备了RGO/W/Cu复合材料。性能测试结果表明,RGO均匀分布于树枝状铜粉体之中,二者结合较好,而且在粉体XRD图谱中检测到了Cu2O相的存在,经过分析和研究,该Cu2O为还原后的超细铜粉被还原氧化石墨烯氧化得到的结果;比较两种工艺制备RGO/Cu复合材料性能,结果显示SPS烧结得到复合材料几乎全致密且晶粒细小,工艺明显优于MP成型;就复合材料中RGO的含量而言,含量为3wt%RGO/Cu复合材料性能最优,特别是SPS烧结3wt%RGO/Cu复合材料显微硬度值高达164.45HV,比此工艺制备纯铜样品提高了32.36%,电导率达到87.51%IACS;RGO/W/Cu复合材料,含钨量为1.0wt%的RGO/W/Cu复合材料综合性能最优。
[Abstract]:High performance copper matrix composites not only have high conductivity and high thermal conductivity, but also have high hardness and strength, and also have good electrical corrosion resistance, so they are widely used in electrical and electronic engineering. In this paper, four kinds of copper-based composite powders were prepared by spray drying, calcination and reduction process, and composite materials were prepared for four kinds of powders. The microstructure, composition and hardness of the composites were characterized. The electrical conductivity, relative density and other properties were tested, and the factors affecting the copper matrix composites were discussed. A series of reliable parameters for the preparation of high performance copper matrix composites have been obtained. 1. High copper tungsten and copper composites with high copper content have been prepared by moulding, plasma sintering (SPS) and cold isostatic pressing (CIPs). The best sintering temperature of 15WCu and 20WCu composites is 1130 鈩，

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