电子束物理气相沉积Cu-Mo复合材料微结构与性能研究

发布时间：2018-03-02 16:45

本文选题：EB-PVD　切入点：强化机制　出处：《稀有金属材料与工程》2017年02期 　论文类型：期刊论文

【摘要】：采用电子束物理气相沉积(EB-PVD)制备了纳米钼颗粒弥散强化铜基复合材料(Mo体积含量为2.5%~10.8%),对其材料微观结构、钼含量和硬度、电阻率关系进行了研究。结果表明:Cu-Mo复合材料中铜基体由柱状晶铜组成,Mo颗粒平均直径为2.4~8.1 nm;随着钼含量增加,铜基体柱状晶宽度逐渐减小,Mo颗粒平均直径逐渐增加,硬度、电阻率逐渐增加;EB-PVD制备的Cu-Mo复合材料主要强化机制为Orowan机制。
[Abstract]:Nanometer molybdenum particles dispersion strengthened copper matrix composites were prepared by electron beam physical vapor deposition (EB-PVD). The volume content of Mo was 2.5 and 10.8%. The microstructure, molybdenum content and hardness of the composites were studied. The results show that the average diameter of Mo particles in Cu matrix consists of columnar crystal copper is 2.4nm, and the average diameter of Mo particles decreases with the increase of molybdenum content, and the average diameter of Mo particles increases with the increase of molybdenum content, and the average diameter of Mo particles increases with the increase of Mo content, and the average diameter of Mo particles increases with the increase of Mo content. The main strengthening mechanism of Cu-Mo composites prepared by EB-PVD is the Orowan mechanism.
【作者单位】：浙江工业大学;哈尔滨工业大学;
【基金】：国家自然科学基金(51104131,51201152) 黑龙江省基金(E201247) 浙江省开放基金(20110929)
【分类号】：TB331

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