织构化硅片表面的摩擦学行为研究

发布时间：2018-03-23 00:24

本文选题：硅片　切入点：表面织构　出处：《北京理工大学》2015年硕士论文　论文类型：学位论文

【摘要】：随着微纳机械器件结构尺寸的微型化，导致表面积与体积之比增大，表面效应明显增强，由此带来严重的粘着、摩擦和磨损问题，影响了器件的工作性能和使用寿命，阻碍了微纳机电系统(MEMS/NEMS)的发展和应用。对MEMS/NEMS表面进行织构化处理，是解决这一问题的有效途径。为此，本文通过试验对微纳尺度下织构化硅片表面的摩擦学行为进行了研究。本文主要工作和结论如下：通过光学光刻和电感耦合等离子体刻蚀技术在单晶硅(100)晶面上进行了柱状织构的构筑，，分别使用扫描电子显微镜和原子力显微镜对织构化硅片表面进行了形貌表征。观测结果表明：在硅片表面上形成了较为规则的圆柱阵列。当相邻织构间的距离保持不变，而直径逐渐增大时，织构覆盖率及表面均方根粗糙度均随之增大。使用配备有胶状探针的原子力显微镜进行了粘着试验，分别在室温下的大气和去离子水环境中对粘着力进行了测量，考察了柱状织构对硅片表面粘着行为产生的影响。测量结果表明：柱状织构起到了显著的减粘作用，同时降低了范德华力和毛细力的大小。当间距一定时，具有较小直径的织构面更有利于粘着力的减小。另外，毛细力对表面粘着力的贡献处于重要地位。使用胶状探针在原子力显微镜下进行了摩擦试验，研究了织构化硅片表面的摩擦行为。试验结果表明：柱状织构减小了探针与硅片表面之间的滑动摩擦力。同样地，当织构的间距一定时，直径越小表面上的摩擦力也越小。此外，通过改变试验中的载荷和滑动速度还发现：织构化表面上的摩擦力随着载荷以及滑动速度的增大而增大，而相对摩擦系数随着载荷的增大而降低。使用原子力显微镜测量硅片表面形貌，对多尺度特性进行了研究，并建立了粗糙表面接触的多尺度模型，探究了表面间的真实接触面积与尺度数之间的关系。计算结果表明：当尺度越来越小时，越来越多更小尺度下的粗糙峰开始出现，表面间的真实接触面积随着尺度数的增加而不断减小。
[Abstract]:With the miniaturization of the structural dimensions of micro / nano mechanical devices, the ratio of surface area to volume is increased, and the surface effect is obviously enhanced. As a result, serious problems of adhesion, friction and wear are brought about, which affect the working performance and service life of the devices. This hinders the development and application of MEMS / NEMS. Texturing the surface of MEMS/NEMS is an effective way to solve this problem. In this paper, the tribological behavior of textured silicon wafers at micro- and nanoscale scale has been studied by experiments. The main work and conclusions are as follows:. By means of optical lithography and inductively coupled plasma etching technique, the columnar texture was constructed on the crystal plane of monocrystalline silicon (100). The morphology of textured silicon wafers was characterized by scanning electron microscope (SEM) and atomic force microscope (AFM). The results show that a regular cylindrical array is formed on the wafer surface, and the distance between adjacent textures remains constant. As the diameter increases, the texture coverage and RMS roughness increase. Adhesion tests were carried out using an atomic force microscope equipped with a colloidal probe, and the adhesion was measured in atmospheric and deionized water environments at room temperature, respectively. The effect of columnar texture on the adhesion behavior of silicon wafer surface is investigated. The results show that the columnar texture plays a significant role in reducing the viscosity and decreasing the van der Waals force and the capillary force. In addition, the contribution of capillary force to surface adhesion is important. The friction behavior of textured silicon wafer surface was studied by using a colloidal probe under atomic force microscope. The results show that the cylindrical texture reduces the sliding friction force between the probe and the wafer surface. When the spacing of texture is constant, the friction force on the surface of the smaller the diameter is also smaller. In addition, by changing the load and sliding velocity in the experiment, it is found that the friction force on the texture surface increases with the increase of the load and the sliding velocity. The relative friction coefficient decreases with the increase of load. The surface morphology of silicon wafer was measured by atomic force microscope (AFM) and the multi-scale model of rough surface contact was established. The relationship between the real contact area between surfaces and the number of scales is investigated. The results show that as the scale becomes smaller and smaller, more and more rough peaks begin to appear. The true contact area between surfaces decreases with the increase of the number of scales.
【学位授予单位】：北京理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TB306;TN304.12

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