新型鼓包仪设计研制及力热作用下薄膜力学性能研究

发布时间：2018-05-08 01:34

本文选题：鼓包仪 + 薄膜材料　；参考：《湘潭大学》2017年硕士论文

【摘要】：随着微纳米技术、微电子技术和微电子机械系统(MEMS)等许多新兴技术的迅速发展,薄膜材料在众多高新技术和传统工业领域获得了越来越广泛的应用。在实际工作过程中,薄膜材料通常是在多种载荷复合加载的复杂条件下服役的。然而,就当前状况而言,学术界和工程界对复杂载荷条件下薄膜材料的变形损伤与破坏机理缺乏深入研究,进而影响到对材料的服役性能评估和寿命预测。此外,高低温、电场、磁场等特殊物理场也会对材料性能带来影响,尤其高温环境下,薄膜材料的的力学行为会发生明显变化。因此,针对特殊物理场开展复杂载荷条件下材料的力学性能测试技术研究显得十分必要。本文根据薄膜材料的工作环境,开发了力热载荷自动控制系统。在原有鼓包仪的基础上进行升级改造,设计和组装了一台力热联合作用下新型多功能鼓包测试平台,为力热作用下服役的薄膜材料力学性能的表征提供了便利。该研究成果为薄膜元件应力分析、失效分析、寿命预测提供可靠的依据,具有非常重要的意义。具体工作内容如下:(1)薄膜力学性能的测试方法有很多,不同之处主要体现在加载手段跟测量手段上。本文首先对力热作用下国内外拉伸、鼓包、压痕等装置进行了分析比较,然后研究了各种测试装置的加热部分,设计了能够产生均匀温度场的加热环境箱以及与之配套使用温度控制系统,并对该装置进行了调试。(2)推导了力热作用下鼓包测试方程。根据材料中任一点的应力张量、温度增量所满足的动力学平衡方程,结合传统常温鼓包模型,对薄膜不同变形阶段进行了力热作用下薄膜鼓包方程的推导。(3)利用自主研制的鼓包实验设备,以两种常见的金属薄膜镍膜和聚合物薄膜PI膜为研究对象,对薄膜材料的力学性能进行研究,在不同工作温度下对样品进行鼓包实验,结合力热鼓包模型,得到了薄膜材料在不同温度下的弹性模量值,并分析了其弹性模量随温度变化的原因。
[Abstract]:With the rapid development of many new technologies, such as micronanotechnology, microelectronic technology and microelectromechanical system (MEMS), thin film materials have been widely used in many fields of high and new technology and traditional industry. In practice, thin film materials are usually in service under complex conditions of multiple loads. However, as far as the current situation is concerned, there is a lack of in-depth research on the deformation damage and failure mechanism of thin film materials under complex loads, which will affect the service performance evaluation and life prediction of the materials. In addition, the special physical fields such as high and low temperature, electric field and magnetic field will also affect the properties of the film, especially at high temperature, the mechanical behavior of the thin film will change obviously. Therefore, it is necessary to study the mechanical properties of materials under complex loads for special physical fields. According to the working environment of thin film material, an automatic control system of force and heat load is developed in this paper. A new multifunctional bulging test platform was designed and assembled on the basis of the original bulging instrument, which provided convenience for the characterization of mechanical properties of thin film materials in service under mechanical heat. The research results provide reliable basis for stress analysis, failure analysis and life prediction of thin film elements. The main work is as follows: 1) there are many methods for measuring the mechanical properties of thin films. The difference lies in the loading and measuring methods. In this paper, the drawing, bulging and indentation are analyzed and compared at home and abroad under the action of force and heat, and then the heating part of various test devices is studied. The heating environment box which can produce uniform temperature field and the corresponding temperature control system are designed. The test equation of bulge under the force and heat action is deduced by debugging the device. According to the dynamic equilibrium equation satisfied by the stress Zhang Liang at any point in the material and the temperature increment, combined with the traditional normal temperature bulging model, The equation of film bulging at different deformation stages was derived. (3) two kinds of common metal film nickel film and polymer film Pi film were studied by using the self-developed bulging experimental equipment. The mechanical properties of the films were studied. The samples were belled at different working temperatures. The elastic modulus of the films at different temperatures was obtained by combining the thermal bulging model. The reason of the change of elastic modulus with temperature is analyzed.
【学位授予单位】：湘潭大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TB383.2

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