导电银浆低温固化薄膜的制备与导电性能

发布时间：2018-06-02 13:31

  本文选题：低温固化 + 导电银浆　； 参考：《粉末冶金材料科学与工程》2017年04期

【摘要】：用银粉作为导电填料,与F型环氧树脂、稀释剂、固化剂等配制成树脂基导电银浆,将导电银浆印刷在载玻片上,在一定温度下固化后得到导电银浆固化膜。通过对薄膜体积电阻率进行测定,以及SEM观察和傅里叶变换红外光谱分析,研究稀释剂种类、稀释剂含量、固化温度和固化时间等因素对导电银浆固化薄膜结构与电阻率的影响。结果表明:松油醇对导电银浆稀释效果好,得到附着力和硬度均较高的固化膜,松油醇含量(质量分数)为8%时,薄膜的体积电阻率达到3.9×10~(-5)?·cm;提高固化温度可降低薄膜的体积电阻率,但温度超过130℃时,电阻率降低不明显;延长固化时间可提高银浆薄膜的导电性能,但当时间达到40 min后,电阻率基本不再随时间延长而发生变化。
[Abstract]:The conductive silver paste based on resin was prepared by using silver powder as conductive filler with F type epoxy resin diluent and curing agent. The conductive silver paste was printed on the glass slide and cured at a certain temperature to obtain the conductive silver paste curing film. By measuring the volume resistivity of thin films, SEM observation and Fourier transform infrared spectroscopy (FTIR), the kinds of diluents and the content of diluents were studied. Effects of curing temperature and curing time on the structure and resistivity of conductive silver paste film. The results show that terpineol has a good dilution effect on conductive silver paste, and a solidified film with high adhesion and hardness is obtained. When the content of terpineol (mass fraction) is 8, The volume resistivity of the film is 3.9 脳 10 ~ (-5)? cm, the volume resistivity of the film can be decreased by increasing the curing temperature, but when the temperature is over 130 鈩，

本文编号：1968938