超高导热金刚石铜表面镀涂技术研究

发布时间：2018-07-23 16:54

【摘要】：金刚石铜复合材料具有高导热率和低膨胀系数,在微电子领域用作Ga N和Si C等高功率芯片的散热热沉,可以显著降低大功率芯片的结温,提高电子产品的可靠性和寿命。通过在金刚石铜复合材料表面上化学镀镍金的方法使表面金属化以改善其焊接性。未做处理的金刚石表面非常光滑,难以和其他金属附着,由于金刚石性质非常稳定,不容易被强酸和强碱表面处理,铜较活泼,采用一般处理方法容易使铜处理过度,而金刚石没反应。对比采用了硝酸、硫酸、氢氧化纳、喷砂、人工打磨等多种方法对金刚石铜表面前处理,效果有限。根据金刚石铜材料特性采用JG-01金刚石铜粗化处理液,能够有效对金刚石进行粗化处理,且对铜无损伤,在金刚石表面形成了连续的蜂窝状微孔,提升金刚石表面镀涂结合力。金刚石铜粗化后通过活化、敏化、化学镍、镀金等镀涂工艺,镍金镀层附着力满足军标热震试验、高温烘烤要求,镀金层覆盖率达到100%,镀层粗糙度显著降低,镀层对金锡和锡铅焊料的可焊性满足产品使用要求。
[Abstract]:Diamond copper composites have high thermal conductivity and low coefficient of expansion. In the field of microelectronics, high power chips such as gan and sic can be used for heat sink, which can significantly reduce the junction temperature of high power chips and improve the reliability and lifetime of electronic products. The surface was metallized by electroless nickel and gold plating on the surface of diamond copper composite to improve its weldability. The surface of untreated diamond is very smooth and difficult to adhere to other metals. Because of the very stable nature of diamond, it is not easy to be treated by strong acid and strong alkali, and copper is more active. The diamond did not respond. Compared with other methods, such as nitric acid, sulfuric acid, sodium hydroxide, sand blasting and artificial grinding, the effect of pretreatment on diamond copper surface is limited. According to the characteristics of diamond copper, JG-01 diamond copper roughening solution can be used to coarsening diamond effectively, and without damage to copper, continuous honeycomb micropores are formed on diamond surface, and the coating adhesion on diamond surface is improved. After roughening of diamond copper, the adhesion of nickel and gold coating meets the thermal shock test of military standard by activation, sensitization, electroless nickel, gold plating and other plating processes. The requirements of high temperature baking, the coverage of gold coating reaches 100 and the roughness of the coating is significantly reduced. The solderability of tin and tin-lead solder can meet the requirements of products.
【作者单位】：中国电子科技集团公司第二十九研究所;
【基金】：国防科工局技术基础科研项目(JSZL2015210B007)资助
【分类号】：TB306

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