不同粗化前处理和硅烷自组装膜处理对ABS树脂表面化学镀铜影响的研究
发布时间：2018-08-11 13:44
【摘要】：ABS是一种重要的工程材料,金属化的ABS树脂在保持耐热性、易加工性等塑料特性的同时,兼具金属的导电性、导磁性等优点,表面金属化的ABS塑料制品机械强度高、耐腐蚀、寿命长,从而进一步扩大了其应用领域,例如在电子行业、电器配件等行业。基底表面的粗化处理是决定化学镀铜层和基底结合力的主要因素,粗化后形成最佳的粗糙度,才能保证后续程序的正常进行,所以本研究通过对比抛光剂打磨粗化处理、碱混合液粗化处理和电晕放电粗化处理三种处理方式来确定最佳的粗化处理方式。另外,硅烷类自组装膜的修饰作用,可以很大程度上促进化学镀铜的沉积,并通过化学键或者配位键和镀铜层连接,增大镀铜层的粘结力,本研究对比APTES,MPTMS,TES硅烷膜的镀铜效果,确定最佳的自组装薄膜。借助接触角仪,SEM,XRD,电化学工作站和盐水浸泡实验、划格实验等实验仪器和方法对化学镀铜层进行表征和研究,得出以下结论:(1)与碱液粗化处理和打磨粗化处理相比,电晕放电粗化处理可以更有有效地活化ABS树脂表面,增加ABS树脂表面的粗糙度,使其表面润湿性提高,接触角值降低至46.3°;(2)经电晕放电粗化处理的ABS树脂表面可以成功的组装TES自组装薄膜。电晕处理后的孔状腔体结构和TES自组装薄膜中的硫原子与铜的强化学配位作用,使得化学镀铜层和ABS树脂基底牢固结合,有很强的粘结力,且化学镀铜层平整光亮,均匀致密,有明亮的铜色。(3)TES自组装薄膜修饰的ABS树脂表面的化学镀铜的沉积速度最快,铜膜厚度最大,MPTMS次之,APTES自组装薄膜修饰的ABS树脂表面的化学镀铜镀速最慢,厚度最薄。(4)扫描电镜图显示,TES自组装薄膜修饰的ABS表面化学镀铜的颗粒的密度非常大,颗粒的直径很小,而且颗粒相互连接,基本上没有明显的裂痕和缝隙存在,而且颗粒基本完全覆盖了树脂的表面,总体来看,镀铜层致密均一连续,品质很好;MPTMS次之,APTES自组装薄膜修饰的ABS树脂表面化学镀铜,其表面的镀铜颗粒基本都是分散且单独存在的,颗粒比较稀疏,颗粒之间的缝隙比较大,粒径较大,覆盖的范围也比较有限。(5)粘结力试验表明,三种自组装薄膜修饰后化学镀铜层和基底之间的粘结力都很强,符合工业设计的要求。(6)XRD图谱显示,三种不同自组装薄膜修饰后的化学镀铜层,其微观结构的晶型均呈现比较强的Cu(111)倾向,TES自组装薄膜修饰的化学镀铜层的电子迁移阻抗性能最好。
[Abstract]:ABS is an important engineering material. The metallized ABS resin not only keeps the properties of plastics such as heat resistance and processability, but also has the advantages of metal conductivity and magnetic conductivity. The surface metallized ABS plastic products have high mechanical strength and corrosion resistance. Long life, thus further expanding its applications, such as electronics, electrical accessories and other industries. The coarsening treatment of substrate surface is the main factor that determines the binding force of electroless copper plating layer and substrate, and the best roughness can be formed after coarsening to ensure the normal proceeding of the follow-up procedure. The coarsening treatment of alkali mixture and corona discharge were used to determine the best coarsening method. In addition, the modification of silane self-assembled films can greatly promote the deposition of electroless copper plating, and increase the adhesion of copper coating by chemical bond or coordination bond to copper coating. In this study, the copper plating effect of APTES / MPTMS320TES silane film was compared. Determine the best self-assembly film. The electroless copper plating layer was characterized and studied by means of contact angle instrument (SEMX XRD), electrochemical workstation and brine immersion experiment, and grid test. The following conclusions were obtained: (1) compared with alkali solution coarsening and grinding roughening, Corona discharge roughening can activate the surface of ABS resin more effectively, increase the surface roughness of ABS resin, and improve the wettability of ABS resin surface. The contact angle was reduced to 46.3 掳. (2) TES self-assembled films could be successfully assembled on the surface of ABS resin treated by corona discharge coarsening. After corona treatment, the pore cavity structure and the enhanced coordination of sulfur atoms in TES self-assembled thin films make the electroless copper plating layer and the ABS resin substrate firmly bonded, and the electroless copper plating layer is smooth, bright and uniform. (3) Electroless copper deposition was the fastest on the surface of ABS resin modified by TES self-assembled film, and the lowest was on the surface of ABS resin modified by TES self-assembled film, followed by the largest thickness of copper film. (4) scanning electron microscopy showed that the particles of electroless copper plating on the surface of ABS modified by tes self-assembled thin film were very dense, the diameter of the particles was very small, and the particles were connected with each other, and there were basically no obvious cracks and cracks. On the whole, the copper-plated layer is compact and uniform, and the quality is very good. The surface of ABS resin modified by APTES self-assembled film is chemically coated with copper. The copper-plated particles on the surface are dispersed and exist alone, the particles are relatively sparse, the gap between the particles is larger, the particle size is larger, and the coverage range is relatively limited. (5) the adhesion test shows that, The adhesion between the electroless copper coating and the substrate is very strong after the modification of the three self-assembled films, which conforms to the requirements of industrial design. (6) the XRD spectra show that the three kinds of self-assembled films are modified by electroless copper plating. The electroless copper coating modified by TES self-assembled thin films has the best electron migration impedance (EMI).
【学位授予单位】：西北农林科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TQ325.2;TB306
本文编号：2177162
[Abstract]:ABS is an important engineering material. The metallized ABS resin not only keeps the properties of plastics such as heat resistance and processability, but also has the advantages of metal conductivity and magnetic conductivity. The surface metallized ABS plastic products have high mechanical strength and corrosion resistance. Long life, thus further expanding its applications, such as electronics, electrical accessories and other industries. The coarsening treatment of substrate surface is the main factor that determines the binding force of electroless copper plating layer and substrate, and the best roughness can be formed after coarsening to ensure the normal proceeding of the follow-up procedure. The coarsening treatment of alkali mixture and corona discharge were used to determine the best coarsening method. In addition, the modification of silane self-assembled films can greatly promote the deposition of electroless copper plating, and increase the adhesion of copper coating by chemical bond or coordination bond to copper coating. In this study, the copper plating effect of APTES / MPTMS320TES silane film was compared. Determine the best self-assembly film. The electroless copper plating layer was characterized and studied by means of contact angle instrument (SEMX XRD), electrochemical workstation and brine immersion experiment, and grid test. The following conclusions were obtained: (1) compared with alkali solution coarsening and grinding roughening, Corona discharge roughening can activate the surface of ABS resin more effectively, increase the surface roughness of ABS resin, and improve the wettability of ABS resin surface. The contact angle was reduced to 46.3 掳. (2) TES self-assembled films could be successfully assembled on the surface of ABS resin treated by corona discharge coarsening. After corona treatment, the pore cavity structure and the enhanced coordination of sulfur atoms in TES self-assembled thin films make the electroless copper plating layer and the ABS resin substrate firmly bonded, and the electroless copper plating layer is smooth, bright and uniform. (3) Electroless copper deposition was the fastest on the surface of ABS resin modified by TES self-assembled film, and the lowest was on the surface of ABS resin modified by TES self-assembled film, followed by the largest thickness of copper film. (4) scanning electron microscopy showed that the particles of electroless copper plating on the surface of ABS modified by tes self-assembled thin film were very dense, the diameter of the particles was very small, and the particles were connected with each other, and there were basically no obvious cracks and cracks. On the whole, the copper-plated layer is compact and uniform, and the quality is very good. The surface of ABS resin modified by APTES self-assembled film is chemically coated with copper. The copper-plated particles on the surface are dispersed and exist alone, the particles are relatively sparse, the gap between the particles is larger, the particle size is larger, and the coverage range is relatively limited. (5) the adhesion test shows that, The adhesion between the electroless copper coating and the substrate is very strong after the modification of the three self-assembled films, which conforms to the requirements of industrial design. (6) the XRD spectra show that the three kinds of self-assembled films are modified by electroless copper plating. The electroless copper coating modified by TES self-assembled thin films has the best electron migration impedance (EMI).
【学位授予单位】：西北农林科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TQ325.2;TB306
【共引文献】
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