氧化铝陶瓷基片的金属化及共烧工艺研究
发布时间：2018-10-14 19:11
【摘要】：陶瓷/金属复合材料具有良好的导电、导热性,耐高温性和较高的机械强度,在混合集成电路和真空电子器件中具有广泛的应用,但是金属与陶瓷的连接较为困难,因此,本文主要就氧化铝陶瓷的金属化工艺及其与金属化浆料的烧结匹配性进行了研究。本文通过流延法制备了氧化铝陶瓷基片,并确定了其制备的工艺参数;通过对金属化浆料的组成和性能以及丝网印刷工艺的研究,确定了金属钨浆料的最佳粘度值和丝网印刷的最优工艺条件;通过对陶瓷基片和钨金属粉的热分析,确定了优化脱脂制度和烧结最高温度,并对产品的性能进行测试分析。氧化铝陶瓷基片流延成型工艺中,浆料固含量为73-75wt%,粘度在1-1.5Pa·s之间,符合流延最佳粘度条件;流延温度控制在30±0.5℃范围内,储料槽中液位高度控制在20±2mm范围,制得的氧化铝生坯片表面平滑,无宏观缺陷。通过对钨金属浆料的性能和丝网印刷工艺参数的研究得:钨金属浆料固含量为80%时,粘度值为110Pa·s,符合丝网印刷要求的粘度范围100-300Pa·s;丝网印刷采用离网间距为1.75mm、刮刀角度为65°、刮刀歪度为20°的工艺,可以得到表面平整,边缘清晰,无空隙,厚度均匀的金属化层图案。通过对氧化铝陶瓷基片和钨金属粉的热分析,确定脱脂温度制度为:室温以1℃/min的升温速率至350℃,其中215℃和350℃各保温15min,再以1.7℃/min升温至600℃,600℃保温10min。脱脂气氛采用氮气保护的湿氢气气氛,避免金属钨被过度氧化。采用1550℃的烧结温度,氧化铝陶瓷和钨金属化层结合紧密,烧结致密,样品达到致密性要求。氧化铝基片烧结收缩率为16.5%,添加还原钨粉后,钨金属化层的烧结收缩率为13.8%,共烧后基本相匹配,无明显缺陷;实验测得试样的方阻小于0.05Ω/□,符合厚膜导体浆料导电性能的标准。
[Abstract]:Ceramic / metal composites have good electrical conductivity, thermal conductivity, high temperature resistance and high mechanical strength. They are widely used in hybrid integrated circuits and vacuum electronic devices, but the connection between metals and ceramics is difficult. In this paper, the metallization process of alumina ceramics and its sintering compatibility with metallized slurry were studied. In this paper, alumina ceramic substrate was prepared by casting method, and the process parameters were determined, and the composition and properties of metallized slurry and screen printing technology were studied. The optimum viscosity value of metal tungsten paste and the optimum process conditions of screen printing were determined, and the optimum degreasing process and the highest sintering temperature were determined by thermal analysis of ceramic substrate and tungsten metal powder, and the properties of the product were tested and analyzed. In the casting process of alumina ceramic substrate, the solid content of slurry is 73-75 wt.The viscosity is between 1-1.5Pa s, which accords with the optimum viscosity condition of casting, the casting temperature is controlled in the range of 30 卤0.5 鈩，
本文编号：2271377
[Abstract]:Ceramic / metal composites have good electrical conductivity, thermal conductivity, high temperature resistance and high mechanical strength. They are widely used in hybrid integrated circuits and vacuum electronic devices, but the connection between metals and ceramics is difficult. In this paper, the metallization process of alumina ceramics and its sintering compatibility with metallized slurry were studied. In this paper, alumina ceramic substrate was prepared by casting method, and the process parameters were determined, and the composition and properties of metallized slurry and screen printing technology were studied. The optimum viscosity value of metal tungsten paste and the optimum process conditions of screen printing were determined, and the optimum degreasing process and the highest sintering temperature were determined by thermal analysis of ceramic substrate and tungsten metal powder, and the properties of the product were tested and analyzed. In the casting process of alumina ceramic substrate, the solid content of slurry is 73-75 wt.The viscosity is between 1-1.5Pa s, which accords with the optimum viscosity condition of casting, the casting temperature is controlled in the range of 30 卤0.5 鈩，
本文编号：2271377
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