电子辐照聚酰亚胺薄膜力学性能演化机理研究
发布时间：2019-01-22 13:57
【摘要】：利用空间综合辐照试验系统和X射线光电子能谱分析(XPS)、热重等分析测试对空间电子辐射环境下聚酰亚胺薄膜力学性能演化及机理进行了研究。研究发现,聚酰亚胺薄膜的拉力、抗拉强度和断裂伸长率随着电子辐照注量的增加先增加而后指数减小。由热重分析可知,电子辐照可引起聚酰亚胺薄膜的失重温度显著降低,在以失重10%作为判据的条件下,其失重温度由595℃下降为583℃。由XPS分析可知,电子辐照诱发聚酰亚胺薄膜化学价键的断裂和交联,在电子辐照初期,C—N键的断裂及引发的交联是导致力学性能增加的主要原因,而随着辐照注量的增加,C=O双键、—N(CO)键的断裂、新的C—N键的形成以及N元素的析出是导致聚酰亚胺薄膜力学性能降低的主要原因。
[Abstract]:The evolution and mechanism of mechanical properties of polyimide films under space electron radiation were studied by means of space integrated radiation test system and X-ray photoelectron spectroscopy (XPS) (XPS), thermogravimetric analysis. It is found that the tensile strength, tensile strength and elongation at break of polyimide films increase first and then decrease with the increase of electron irradiation flux. The results of thermogravimetric analysis show that the weight loss temperature of polyimide films can be significantly reduced by electron irradiation, and the weight loss temperature decreases from 595 鈩，
本文编号：2413275
[Abstract]:The evolution and mechanism of mechanical properties of polyimide films under space electron radiation were studied by means of space integrated radiation test system and X-ray photoelectron spectroscopy (XPS) (XPS), thermogravimetric analysis. It is found that the tensile strength, tensile strength and elongation at break of polyimide films increase first and then decrease with the increase of electron irradiation flux. The results of thermogravimetric analysis show that the weight loss temperature of polyimide films can be significantly reduced by electron irradiation, and the weight loss temperature decreases from 595 鈩，
本文编号：2413275
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