基于介质阻挡放电实现高分子薄膜与金属层间有机黏合实验方法

发布时间：2019-02-27 09:43

【摘要】：提出一种新型的金属与聚乙烯薄膜层间有机黏合方法,能够实现薄膜层之间的有机黏合。该方法基于大气压Ar/O2介质阻挡放电对聚乙烯薄膜表面改性预处理,利用射频电感耦合等离子体增强非平衡磁控溅射系统在预处理的聚乙烯薄膜表面镀铜膜。研究结果表明,介质阻挡放电处理聚乙烯薄膜表面,引入了氧原子功能团(C—O,C=O,O—C=O等),导致薄膜表面自由能的增加。此外,这种方法得到的薄膜层之间黏着强度为1.5 MPa;而铜膜与未进行等离子体预处理聚乙烯之间的黏着强度仅为0.8 MPa。此外,SEM照片也显示,经过等离子体预处理后聚乙烯表面的电镀铜膜晶粒较小且分布更均匀。
[Abstract]:A new method of organic bonding between metal and polyethylene film is proposed, which can realize the organic bonding between metal and polyethylene film. The method is based on the pretreatment of polyethylene film surface by atmospheric pressure Ar/O2 dielectric barrier discharge. The copper film is deposited on the surface of pretreated polyethylene film by RF inductively coupled plasma enhanced unbalanced magnetron sputtering system. The results show that oxygen atom functional groups (C _ (O), O ~ (2 +) are introduced into the surface of polyethylene film treated by dielectric barrier discharge (DBD), which leads to the increase of the free energy on the surface of the film. In addition, the adhesion strength between the films obtained by this method is 1.5 MPa;, while the adhesion strength between copper film and unpretreated polyethylene is only 0.8 MPa.. In addition, SEM images also show that the grain size of copper plating film on the surface of polyethylene is smaller and more uniform after plasma pretreatment.
【作者单位】：南昌大学物理系;大连理工大学物理与光电工程学院;
【基金】：国家自然科学基金项目(11465013) 江西省科技厅自然科学基金项目(20151BAB212012,20161BAB201013)
【分类号】：TB306;TQ153.14

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