套管封装相变材料准稳态传热模型研究

发布时间：2019-03-19 21:41

【摘要】：本文建立了套管封装相变材料的准稳态简化传热模型,对定温边界条件下相变套管凝固、熔化过程的传热特性进行了模拟分析。进一步将准稳态简化模型的模拟结果与套管封装相变材料CFD数值传热模型的计算结果进行对比分析。结果表明,在相变过程中,准稳态简化模型计算的套管内工质(不流动)的温度与通过内、外套管表面热流及其变化趋势与数值计算结果一致,温度平均误差小于0.5℃,热流平均误差小于10%,模型准确性较好。准稳态简化传热模型的计算时间不到数值模型计算时长的1%,计算效率高,易于嵌入建筑热湿软件包进行集成模拟分析。
[Abstract]:In this paper, a simplified quasi-steady-state heat transfer model for casing packaging phase change materials is established, and the heat transfer characteristics of phase change casing solidification and melting under constant temperature boundary conditions are simulated and analyzed. Furthermore, the simulation results of the simplified quasi-steady state model and the numerical heat transfer model of the casing package phase change material (CFD) are compared and analyzed. The results show that, in the process of phase transition, the temperature of the working fluid (non-flow) calculated by the quasi-steady-state simplified model is in agreement with that of the inner casing and the heat flux on the surface of the casing and its variation trend is consistent with the numerical results, and the average temperature error is less than 0.5 鈩，

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