负载铜石墨烯增强的铜基块体复合材料组织及性能的研究

发布时间：2019-05-26 18:35

【摘要】：由于石墨烯具有优异的电学和力学性能,以石墨烯作为增强体,将其和易成型的铜复合在一起有望开发出综合性能优异的石墨烯增强铜基复合材料,满足现代工业快速发展的要求。本文采用原位还原法制备负载铜石墨烯粉末(Cu-dopedRGO)、采用球磨+热压法烧结制备负载铜石墨烯增强的铜基块体复合材料。利用电镜扫描(SEM)、透射电子显微镜(TEM)、拉曼光谱仪(Raman)和X射线光电子能谱仪(XPS)对负载铜石墨烯复合粉体的组织、形貌、尺寸、分布情况、结构、复合粉体中化学键的结合态进行表征和分析,利用X射线衍射(XRD)、电镜扫描(SEM)对负载铜石墨烯复合粉体和铜粉的混合粉末以及负载铜石墨烯增强的铜基块体复合材料微观组织进行表征,并对不同负载铜石墨烯含量的铜基复合材料致密度、导电率和硬度等性能进行测试,通过以上研究得出下面的结论。(1)采用原位还原法合成负载铜石墨烯,在磁力加热搅拌的环境下干燥可获得无其他杂质纯净的复合粉体。负载铜石墨烯复合粉体中铜粒子基本均匀的分布在石墨烯片层上,部分铜粒子被石墨烯片层包裹,有效地改善了石墨烯的团聚,提高了石墨烯的分散性。(2)随着pH值的增大,负载铜石墨烯片层上负载的铜粒子粒径减小。当pH值为12时,石墨烯片层上负载的铜粒子平均粒径小于l00nnm。(3)随着负载铜石墨烯含量的增加,采用500nm铜粉制备的负载铜石墨烯增强的铜基块体复合材料致密度先增大后下降,硬度不断上升,与纯铜相比提高了 150%,而导电率却略有下降,当负载石墨烯添加量为1.5wt%时,负载铜石墨烯增强的铜基块体复合材料的导电率也达87%IACS,与纯铜相比降低了 10%。负载铜石墨烯增强的铜基块体复合材料综合性能与纯铜相比更加优异。(4)与采用50μim铜粉制备的负载铜石墨烯增强的铜基复合材料相比,采用50nm铜粉制备的负载铜石墨烯增强的铜基复合材料表面组织分布均匀,负载铜石墨烯团聚不明显。说明纳米铜粉有效的阻止了负载铜石墨烯的团聚,改善了团聚现象。(5)随着负载铜石墨烯含量的增加,采用50μm铜粉制备的负载铜石墨烯增强的铜基块体复合材料和采用50nm铜粉制备的负载铜石墨烯增强的铜基块体复合材料的致密度、导电率和硬度均有下降,但两者下降幅度不同。采用50μm铜粉制备的负载铜石墨烯增强的铜基复合材料致密度、导电率和硬度下降了 15%、30%和30%,而采用50nm铜粉制备的负载铜石墨烯增强的铜基复合材料致密度、导电率和硬度下降分别为5%、15%和25%。硬度相比于纯铜都有所提高,分别提升了 30%和115%。采用50nm铜粉制备的负载铜石墨烯增强的铜基复合材料的各项性能均优于采用50μm铜粉制备的负载铜石墨烯增强的铜基块体复合材料。
[Abstract]:Because graphene has excellent electrical and mechanical properties, graphene is used as reinforcement to combine graphene with easily formed copper, which is expected to develop graphene reinforced copper matrix composites with excellent comprehensive properties. To meet the requirements of the rapid development of modern industry. In this paper, loaded copper graphene powder (Cu-dopedRGO) was prepared by in situ reduction method, and copper matrix bulk composites reinforced with copper graphene were prepared by ball milling and hot pressing sintering. The microstructure, morphology, size, distribution and structure of copper graphene composite powder were studied by electron microscope scanning (SEM), transmission electron microscope (TEM), Raman spectrometer (Raman) and X-ray photoelectron spectrometer (XPS). The bound states of chemical bonds in the composite powder were characterized and analyzed by X-ray diffraction (XRD),). The microstructure of the mixed powder of copper graphene composite powder and copper powder and the microstructure of copper matrix composites reinforced with copper graphene were characterized by scanning electron microscope (SEM), and the density of copper matrix composites with different copper graphene content was also characterized. Through the above research, the following conclusions are drawn. (1) loaded copper graphene can be synthesized by in situ reduction method, and the composite powder without other impurities can be obtained by drying in the environment of magnetic heating and stirring. The copper particles in the loaded copper graphene composite powder are basically uniformly distributed on the graphene lamellar layer, and some copper particles are wrapped in the graphene lamellar layer, which effectively improves the agglomeration of graphene. The dispersion of graphene was improved. (2) with the increase of pH value, the particle size of copper particles loaded on copper graphene layer decreased. When the pH value is 12:00, the average particle size of copper particles loaded on graphene lamellar is less than 1 00nm. (3) with the increase of copper graphene content, The density of copper matrix bulk composites reinforced with copper graphene increased at first and then decreased, and the hardness increased by 150% compared with pure copper, but the conductivity decreased slightly. When the content of graphene is 1.5wt%, the conductivity of copper matrix composites reinforced with copper graphene is 87% IAC, which is 10% lower than that of pure copper. The comprehensive properties of copper matrix composites reinforced with copper graphene are better than those of pure copper. (4) compared with copper matrix composites reinforced with copper graphene supported with 50 渭 im copper powder, The surface structure of copper matrix composites reinforced with copper graphene was uniform, and the agglomeration of copper graphene loaded with copper graphene was not obvious. The results show that nano-copper powder can effectively prevent the agglomeration of loaded copper graphene and improve the agglomeration phenomenon. (5) with the increase of copper graphene content, The density, conductivity and hardness of copper matrix bulk composites reinforced with copper graphene and copper matrix composites reinforced with copper graphene were decreased by 50 渭 m copper powder and 50nm copper powder, but the decrease range was different. The density, conductivity and hardness of copper matrix composites reinforced with copper graphene were reduced by 15%, 30% and 30%, respectively, while the density of copper matrix composites reinforced with copper graphene was prepared by using 50 渭 m copper powder, while the density of copper matrix composites reinforced with copper graphene was reduced by 15%, 30% and 30%, respectively, and the density of copper matrix composites reinforced with copper graphene was obtained by using 50nm copper powder. The conductivity and hardness decreased by 5%, 15% and 25%, respectively. Compared with pure copper, the hardness is increased by 30% and 115%, respectively. The properties of copper matrix composites reinforced with copper graphene supported on 50nm copper powder are better than those reinforced with copper graphene supported copper matrix composites prepared with 50 渭 m copper powder.
【学位授予单位】：西安理工大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TB33

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