碳纳米管铜基复合材料的制备及性能研究
发布时间：2019-05-29 18:23
【摘要】：随着现代工业技术的迅猛发展以及人们对铜及其合金的性能要求的不断提高,传统的铜合金已经不足以满足人们的需要,而铜基复合材料的出现打破了合金性能的局限。碳纳米管(CNTs)因其独特的结构和性能,被视为铜基复合材料的理想增强体材料,但碳纳米管易团聚不易分散,因而解决其与铜复合时的分散和界面结合问题才能提高复合材料的最终性能。本文通过对CNTs进行表面化学预处理和表面化学镀,机械球磨制备复合粉体,最后经模压成形和真空气氛烧结,制得碳纳米管铜基复合材料,研究了球磨转速、球磨时间和CNTs质量分数对CNTs与铜粉的复合粉体分散性的影响以及镀铜CNT质量分数对碳纳米管铜基复合材料的力学、电学、组织性能等的影响。又通过计算机数值模拟研究了碳纳米管铜基复合材料发生塑性变形时内部碳纳米管的定向排列或者定向分布问题。得出以下结论：(1)实验采用化学镀的方法在碳纳米管表面镀铜,以改善碳纳米管的润湿性和界面结合性。在CNTs化学镀铜前,对CNTs进行预处理,通过纯化和氧化来改善CNTs的分散性,又通过敏化处理和活化处理增加CNTs上的活性点。实验选择的化学镀温度为80℃,pH值为12.5。经化学镀铜处理后可以在碳纳米管表面获得一层均匀的纳米铜颗粒沉积。(2)机械球磨的最佳实验条件为：转速350 r/min、时间2小时。复合材料的硬度随CNTs质量分数的增加先增大后减小,质量分数0.75%左右硬度最佳,相对于粉末冶金纯铜提高了11%。随着CNTs质量分数的增加,其密度和致密度不断减小,导电性也不断降低,0.75%时,电导率为45.24 MS/m,相对与粉末冶金纯铜仅降低了7%。添加质量分数为0.75%的镀铜碳纳米管制备的铜基复合材料兼具良好电性能和优异的力学性能。(3)碳纳米管铜基复合材料发生塑性变形后,碳纳米管在基体分布随之发生变化,碳纳米管的弯曲程度有所减小。化学镀铜与粉末冶金相结合,可以有效改善复合材料的最终性能,是开发高性能铜基复合材料的有效方法。而计算机仿真模拟CNTs的定向排列对制备高强度高导电的理想复合材料具有良好的指引作用。
[Abstract]:With the rapid development of modern industrial technology and the continuous improvement of the performance requirements of copper and its alloys, the traditional copper alloys are no longer enough to meet the needs of people, and the emergence of copper matrix composites has broken the limitations of alloy properties. Carbon nanotube (CNT) (CNTs) is regarded as an ideal reinforcement material for copper matrix composites because of its unique structure and properties, but CNT is easy to agglomeration and difficult to disperse. Therefore, the final properties of the composites can be improved only by solving the dispersion and interface bonding problems when they are combined with copper. In this paper, the composite powder was prepared by surface chemical pretreatment and surface chemical plating of CNTs, and the composite powder was prepared by mechanical ball milling. Finally, the carbon nanotube copper matrix composites were prepared by molding and vacuum atmosphere sintering, and the rotating speed of ball milling was studied. The effect of ball milling time and CNTs mass fraction on the dispersion of CNTs and copper powder composite powder and the effect of copper plating CNT mass fraction on the mechanics, electricity, microstructure and properties of carbon nanotube copper matrix composites. The directional arrangement or directional distribution of carbon nanotubes during plastic deformation of carbon nanotube copper matrix composites was studied by computer numerical simulation. The conclusions are as follows: (1) Electroless plating of copper on the surface of carbon nanotubes was used to improve the wettability and interfacial adhesion of carbon nanotubes. Before CNTs chemical copper plating, CNTs was pretreated, the dispersion of CNTs was improved by purification and oxidation, and the active point on CNTs was increased by sensitizing treatment and activation treatment. The experimental results show that the temperature of Electroless plating is 80 鈩，
本文编号：2488125
[Abstract]:With the rapid development of modern industrial technology and the continuous improvement of the performance requirements of copper and its alloys, the traditional copper alloys are no longer enough to meet the needs of people, and the emergence of copper matrix composites has broken the limitations of alloy properties. Carbon nanotube (CNT) (CNTs) is regarded as an ideal reinforcement material for copper matrix composites because of its unique structure and properties, but CNT is easy to agglomeration and difficult to disperse. Therefore, the final properties of the composites can be improved only by solving the dispersion and interface bonding problems when they are combined with copper. In this paper, the composite powder was prepared by surface chemical pretreatment and surface chemical plating of CNTs, and the composite powder was prepared by mechanical ball milling. Finally, the carbon nanotube copper matrix composites were prepared by molding and vacuum atmosphere sintering, and the rotating speed of ball milling was studied. The effect of ball milling time and CNTs mass fraction on the dispersion of CNTs and copper powder composite powder and the effect of copper plating CNT mass fraction on the mechanics, electricity, microstructure and properties of carbon nanotube copper matrix composites. The directional arrangement or directional distribution of carbon nanotubes during plastic deformation of carbon nanotube copper matrix composites was studied by computer numerical simulation. The conclusions are as follows: (1) Electroless plating of copper on the surface of carbon nanotubes was used to improve the wettability and interfacial adhesion of carbon nanotubes. Before CNTs chemical copper plating, CNTs was pretreated, the dispersion of CNTs was improved by purification and oxidation, and the active point on CNTs was increased by sensitizing treatment and activation treatment. The experimental results show that the temperature of Electroless plating is 80 鈩，
本文编号：2488125
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