新型苯并环丁烯官能化POSS及其衍生聚合物的制备与表征
发布时间：2019-08-08 13:30
【摘要】：基于笼型倍半硅氧烷(POSS)的有机-无机杂化纳米复合低介电材料由于具有良好的综合性能,在微电子封装中存在潜在应用。然而目前基于POSS的可聚合单元通常含有氋极性基团,对材料低介电性能造成了不利影响。基于苯并环丁烯(BCB)基团在高性能低介电材料中的独特优势,利用POSS的Heck反应,在POSS上引入BCB官能团,进而制备形成衍生聚合物。核磁氢谱表明成功实现了POSS的BCB官能化,取代率达到约50%。差示热量测试表明BCBPOSS通过[~(2+)4]环加成实现了交联聚合。热重测试表明BCB-POSS交联树脂具有优异的热稳定性能。扫描探针显微镜结果表明BCB-POSS交联树脂薄膜表面光洁性较好,满足微电子应用的基本要求。
[Abstract]:Organic-inorganic hybrid nanocomposite low dielectric materials based on cage silsesquioxane (POSS) have potential applications in microelectronic packaging because of their good comprehensive properties. However, at present, the polymerizable units based on POSS usually contain polar groups, which have a negative effect on the low dielectric properties of the materials. Based on the unique advantages of benzocyclobutene (BCB) group in high performance and low dielectric materials, BCB functional groups were introduced into POSS by Heck reaction of POSS, and then derivative polymers were prepared. The nuclear magnetic hydrogen spectrum shows that the BCB functionalization of POSS is successfully realized, and the substitution rate is about 50%. The differential heat test showed that the cross-linking polymerization of BCBPOSS was realized by [~ (2) 4] cycloaddition. Thermogravimetric test showed that BCB-POSS crosslinked resin had excellent thermal stability. The results of scanning probe microscope show that the surface finish of BCB-POSS crosslinked resin film is good, which meets the basic requirements of microelectronics application.
【作者单位】： 西南科技大学材料科学与工程学院;四川省非金属复合与功能材料重点实验室-省部共建国家重点实验室培育基地西南科技大学材料科学与工程学院;
【基金】：西南科技大学博士基金资助项目(10zx7116)
【分类号】：TB33;TQ317
本文编号：2524395
[Abstract]:Organic-inorganic hybrid nanocomposite low dielectric materials based on cage silsesquioxane (POSS) have potential applications in microelectronic packaging because of their good comprehensive properties. However, at present, the polymerizable units based on POSS usually contain polar groups, which have a negative effect on the low dielectric properties of the materials. Based on the unique advantages of benzocyclobutene (BCB) group in high performance and low dielectric materials, BCB functional groups were introduced into POSS by Heck reaction of POSS, and then derivative polymers were prepared. The nuclear magnetic hydrogen spectrum shows that the BCB functionalization of POSS is successfully realized, and the substitution rate is about 50%. The differential heat test showed that the cross-linking polymerization of BCBPOSS was realized by [~ (2) 4] cycloaddition. Thermogravimetric test showed that BCB-POSS crosslinked resin had excellent thermal stability. The results of scanning probe microscope show that the surface finish of BCB-POSS crosslinked resin film is good, which meets the basic requirements of microelectronics application.
【作者单位】： 西南科技大学材料科学与工程学院;四川省非金属复合与功能材料重点实验室-省部共建国家重点实验室培育基地西南科技大学材料科学与工程学院;
【基金】：西南科技大学博士基金资助项目(10zx7116)
【分类号】：TB33;TQ317
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1 黄钊;硅基Ⅲ-Ⅴ族混合集成激光器的理论设计与关键工艺研究[D];华中科技大学;2014年
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