银粉形貌及粒径对无铅导电银浆性能的影响

发布时间：2018-10-08 12:11

【摘要】：通过银粉的不同形貌、粒径以及级配研究其对无铅导电银浆烧结后膜层的电阻率和附着力的影响。选取了平均粒径为0.50,0.91,2.09,3.36μm的球形银粉和4.3μm的片状银粉,首先将5种银粉各自制备成无铅导电银浆,选出银浆性能最优的银粉,再将此银粉搭配纳米级银粉和片状银粉制备无铅导电银浆。通过扫描电子显微镜(SEM)观察浆料烧结银膜的形貌,用四探针测试仪测量烧结银膜的电阻率,通过拉伸试验测试烧结银膜的附着力,讨论了银粉形貌及粒径对无铅导电银浆烧结膜附着力和电阻率的影响。结果表明,当为纯球形银粉或片状银粉时,球形银粉制备的银浆电阻率和附着力最优,且球形银粉粒径为0.91μm时最优,电阻率为33.3μΩ·cm,附着力为3.193 N;添加纳米级银粉能改善银浆的电性能,在添加量为4%时最优,电阻率为30.9μΩ·cm,附着力为3.253 N;添加片状银粉的含量在8%时最优,电阻率为27.7μΩ·cm,附着力为3.478 N。
[Abstract]:The effects of silver powder morphology, particle size and gradation on the resistivity and adhesion of lead-free conductive silver paste were studied. Spherical silver powder with an average diameter of 0.50 ~ 0.91 ~ 2.09 ~ 3.36 渭 m and a sheet silver powder of 4.3 渭 m were selected. Firstly, five kinds of silver powder were prepared into lead-free conductive silver paste, and the silver powder with the best silver paste performance was selected. Then the silver powder was mixed with nanometer silver powder and flake silver powder to prepare lead-free conductive silver paste. The morphology of sintered silver film was observed by scanning electron microscope (SEM), the resistivity of sintered silver film was measured by four-probe tester, and the adhesion of sintered silver film was measured by tensile test. The effects of the morphology and particle size of silver powder on the adhesion and resistivity of lead-free conductive silver paste sintered film were discussed. The results show that when the silver powder is pure spherical or flake silver powder, the resistivity and adhesion of silver paste prepared by spherical silver powder are the best, and the particle size of spherical silver powder is 0.91 渭 m. The resistivity is 33.3 渭惟 cm, the adhesion is 3.193 N, the addition of nano-silver powder can improve the electrical properties of silver paste, the resistivity is 30.9 渭惟 cm, 3.253 N, the addition amount of silver powder is 4, and the addition of silver flake powder is optimal when the content of silver powder is 8 渭惟, the resistivity is 27.7 渭惟 cm, and the adhesion force is 3.478 N.
【作者单位】：昆明理工大学材料科学与工程学院;贵研铂业股份有限公司;
【基金】：国家自然科学基金项目(51262017,51362017) 云南省稀贵金属先进材料协同创新中心协同创新基金项目(14051708)资助
【分类号】：TM24

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