电子产品组装CAPP系统研究与开发

发布时间：2018-01-03 15:45

本文关键词：电子产品组装CAPP系统研究与开发　出处：《三峡大学》2015年硕士论文　论文类型：学位论文

【摘要】：电子产品组装工艺规划是电子产品生产过程中的关键环节，缩短印刷电路板组装工艺规程准备时间，提高工艺规划质量，是提高电子产品质量和电子产品生产企业效益的关键环节。本文就以电子产品组装工艺为基础，结合CAPP系统开发基本原理，对电子产品组装CAPP系统做了深入研究，同时对原型系统的开发过程做了详细的讲解。本文的研究工作和主要内容包括：（1）基于可组装性分析的电子产品组装CAPP系统研究。分析电子产品组装工艺过程及特点，结合CAPP系统基本理论和构建方法，提出电子产品组装CAPP系统基本概念，并对系统总体结构、基本功能模块、实现方法、关键技术和开发环境工具做了深入分析；提出了电子产品可组装性分析基本概念，应用多色集合理论建立可组装性分析模型，结合多色集合逻辑推理实现可组装性分析，最终根据企业实际生产情况生成可组装性分析报告。（2）电子产品组装工艺规划研究。归纳总结电子产品组装过程中印制电路板的组装工艺流程，构建系统开发典型工艺知识库，结合修订式CAPP系统开发技术和基本原理，开发符合电子产品组装的CAPP系统；以复合式贴片机贴装过程优化为例，首先建立了贴装过程优化模型，然后用遗传算法和元胞遗传算法对模型求解，最终得到贴装过程优化结果，将结果应用于系统后续工时定额分析。（3）基于模型库的贴装过程仿真研究。基于Pro/E二次开发技术，应用其三维参数化建模功能，建立常用电子封装元器件三维参数化模型库，再用三维仿真技术实现典型贴装设备的三维动态仿真，通过仿真技术及时发现电子产品组装过程中可能出现的缺陷。（4）电子产品组装CAPP系统拓展研究。结合电子产品组装工艺以及电子产品生产企业的特点，应用多色集合约束模型建立了PCB组装柔性车间调度多目标优化模型，基于模型约束下改进NSGA-II多目标优化算法对模型进行求解，得到调度甘特图，并将上述优化模块集成到电子产品组装CAPP系统，更进一步完善了系统功能。（5）电子产品组装CAPP系统总体设计和实现。对电子产品组装CAPP系统总体框架和模块功能进行规划分析，对分功能模块进行设计实现，开发了电子产品组装CAPP原型系统，，并对系统功能进行说明，同时给出了系统的运行实例。
[Abstract]:The electronic product assembly process planning is the key link in the electronic product production process. It shortens the preparation time of the printed circuit board assembly process rules and improves the quality of the process planning. It is a key link to improve the quality of electronic products and the efficiency of electronic production enterprises. This paper is based on the assembly process of electronic products and the basic principle of CAPP system development. The CAPP system of electronic product assembly is deeply studied, and the development process of the prototype system is explained in detail. The research work and main contents of this paper include: 1) the research of electronic product assembly CAPP system based on assemblability analysis. The process and characteristics of electronic product assembly are analyzed, and the basic theory and construction method of CAPP system are combined. The basic concept of electronic product assembly CAPP system is put forward, and the system structure, basic function module, realization method, key technology and development environment tool are analyzed deeply. The basic concept of assemblability analysis of electronic products is put forward. The analysis model of assemblability is established by using the theory of polychromatic set, and the analysis of assemblability is realized by combining the logic reasoning of polychromatic set. Finally, according to the actual production situation of the enterprise to generate assembly analysis report. Research on assembly process planning of electronic products. Summarize the assembly process of printed circuit board in the process of assembly of electronic products, and construct the knowledge base of system development typical process. Combined with the development technology and basic principle of the revised CAPP system, the CAPP system which accords with the assembly of electronic products is developed. Taking the process optimization of composite mounting machine as an example, the optimization model of mounting process is established first, then the model is solved by genetic algorithm and cellular genetic algorithm, and finally the optimization results of the process are obtained. The results are applied to the system follow-up man-hour quota analysis. Based on the secondary development technology of Pro/E, the 3D parameterized model library of electronic packaging components is established by using its 3D parameterized modeling function. The 3D dynamic simulation of typical mount equipment is realized by using 3D simulation technology, and the possible defects in the assembly process of electronic products can be found by simulation technology. Electronic product assembly CAPP system development research, combined with electronic product assembly process and the characteristics of electronic product manufacturing enterprises. The multi-objective optimization model of PCB assembly flexible job shop scheduling is established by using the multi-color set constraint model. The model is solved based on the improved NSGA-II multi-objective optimization algorithm under the model constraints. The scheduling Gantt diagram is obtained, and the above optimization module is integrated into the electronic product assembly CAPP system, which further improves the function of the system. 5) the overall design and implementation of electronic product assembly CAPP system. The overall framework and module functions of electronic product assembly CAPP system are planned and analyzed, and the sub-functional modules are designed and implemented. The prototype system of electronic product assembly CAPP is developed, and the function of the system is explained. At the same time, the running example of the system is given.
【学位授予单位】：三峡大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN05

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