不同电子封装结构的随机振动分析

发布时间：2018-01-11 14:01

本文关键词：不同电子封装结构的随机振动分析　出处：《焊接学报》2017年07期 　论文类型：期刊论文

【摘要】：基于ABAQUS有限元软件,对同一PCB板上的QFP和PBGA两种不同封装结构,在随机振动载荷下的应力场进行了研究,并对不同封装结构性能进行了比较分析.结果表明,在随机振动载荷下,无论是QFP封装组件还是PBGA封装组件,越靠近PCB板边缘,器件的应力值越大;在同等条件下,PBGA封装器件的应力值要高于QFP封装器件;以同类封装器件中最大应力值的10%为临界点,封装器件中应力值比最大应力值低10%以上的为非薄弱元器件,其余均定义为薄弱元器件.根据该定义,对于5组QFP封装器件而言,QFP-1器件和QFP-5器件为薄弱元器件;而对于5组PBGA封装器件,仅有PBGA-3器件为非薄弱元器件.
[Abstract]:Based on the finite element software ABAQUS, on the PCB board of QFP and PBGA in two different package structure under random vibration loading stress field is studied, and the performance of different package structure were analyzed. The results show that the random vibration loads, both the QFP package or PBGA packages that is close to the edge of the PCB board, the greater the value of the stress of the device; under the same conditions, PBGA package stress value is higher than that of QFP package; with the same package in the maximum stress value of 10% as the critical point, the stress value is higher than the maximum stress value lower than 10% for non weak components the package, the rest are defined as weak components. According to this definition, for the 5 QFP devices, QFP-1 devices and QFP-5 devices for weak components; and the 5 group of PBGA packages, only PBGA-3 devices for non weak components.

【作者单位】：上海理工大学教育部微创医疗器械工程中心;
【基金】：上海市自然科学基金资助项目(15ZR1428200) 上海工程技术研究中心资助项目(15DZ2251700)
【分类号】：O324;TN405
【正文快照】： 0序言在目前常用的电子封装器件中,四边扁平封装(quad flat packaging,QFP)及塑料封装球栅阵列(Plastic Ball Grid Array,PBGA)器件是现代电子产品中重要的表面组装元器件.其中,QFP封装具有外形尺寸小、寄生参数小、适合高频率使用、操作方便、可靠性高等优点,适用于表面组装

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