CMP后清洗中非离子表面活性剂对Cu表面状态的影响

发布时间：2018-01-11 18:44

本文关键词：CMP后清洗中非离子表面活性剂对Cu表面状态的影响　出处：《微纳电子技术》2017年10期 　论文类型：期刊论文

【摘要】：为解决化学机械平坦化(CMP)后Cu表面存在表面粗糙度大、侵蚀等问题,以表面活性剂为基础研制新型碱性清洗剂。采用对比实验研究了脂肪醇聚氧乙烯醚(JFC)、聚乙二醇(PEG)、高碳脂肪醇聚氧乙烯醚(AEO)和FA/O四种非离子表面活性剂的表面张力,得出FA/O非离子表面活性效果最好且使清洗液表面张力最低。再通过原子力显微镜(AFM)测试以及电化学测试,进一步研究不同体积分数的非离子表面活性剂对Cu表面状态的影响,得出碱性清洗剂选用体积分数为0.15%的FA/O非离子表面活性剂时最佳。实验结果表明:当清洗液中FA/O表面活性剂体积分数为0.15%、FA/OⅡ螯合剂体积分数为0.015%时,表面粗糙度为1.3 nm,界面腐蚀现象基本不存在。说明表面活性剂增大了清洗液在CMP后清洗过程的渗透性与铺展作用,使Cu表面状态得到优化。
[Abstract]:In order to solve the problem of chemical mechanical planarization (CMP) after the Cu surface has large surface roughness, erosion and other issues, the development of new alkaline cleaning agent with surfactant. The effect of fatty alcohol polyoxyethylene ether by contrast experiment (JFC), polyethylene glycol (PEG), high fatty alcohol polyoxyethylene ether (AEO) surface the tension and the FA/O four kind of nonionic surfactant, the FA/O nonionic surfactant and the cleaning effect is the best. The minimum surface tension of liquid by atomic force microscope (AFM) test and electrochemical test. The effect of nonionic surfactant for further study of different volume fractions on the surface of Cu state, the alkaline cleaning agent selection the volume fraction of 0.15% FA/O nonionic surfactant is the best. The experiment results show that when the cleaning liquid in the FA/O surfactant volume fraction is 0.15%, FA/O II chelating agent when the volume fraction is 0.015%, the surface roughness For 1.3 nm, the phenomenon of interfacial corrosion does not exist. It shows that surfactant increases the permeability and spreading effect of cleaning fluid after CMP cleaning, and makes the surface state of Cu be optimized.

【作者单位】：河北工业大学电子信息工程学院;天津市电子材料与器件重点实验室;
【基金】：国家中长期科技发展规划02科技重大专项资助项目(2016ZX02301003-004-007)
【分类号】：TN405
【正文快照】： FA/O(C58H118O24)的表面张力大小,选出能够提0　引　言高Cu表面状态的活性剂以及最佳用量,进行原子在微电子制造过程中力显微镜测试以及电化学测试,研究表面活性剂对,Cu由于电阻率低、电迁移小、Cu表面状态的优化。FA/O碱性清洗剂与表面活RC延迟时间短,已取代Al成为主要的高性

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