高可靠厚膜功率组件低空洞烧结设计与工艺技术研究

发布时间：2018-01-16 04:20

本文关键词：高可靠厚膜功率组件低空洞烧结设计与工艺技术研究　出处：《北华航天工业学院》2015年硕士论文　论文类型：学位论文

【摘要】：在当今电子工业高速发展的时代,随着厚膜混合集成电路向着高性能、高可靠、小型化、高均一性及低成本方向的发展,对厚膜混合电路的组装技术和工艺提出了越来越高的要求。在厚膜混合集成电路中,功率组件是核心器件,决定着厚膜功率组件的性能和热响应情况。在厚膜功率组件的组装中,现在主要存在的问题是:由于焊接的器件空洞较多,所以工作时产生的热量不能有效地发散,最终使器件的工作结温高,降低了其使用寿命,甚至个别零件由于温度较高而导致电压击穿。影响空洞产生的因素有很多,本文经过查阅大量的文献,结合国内外发展现状,分别从厚膜管壳、基板的尺寸;焊料成分、状态(焊片、焊膏)的选用;工艺曲线(真空度、还原气氛、温度设置)各个方面来减小孔洞率,其后通过外观、X射线、金相分析、剪切力测试分析厚膜功率器件的孔洞率、可靠性,找出形成空洞的真正原因是焊料在烧结过程中残留的气体和氧化物无法排出。结果表明:回流焊中通过对工艺温度曲线、焊接层厚度、压力的分析,找到了各自合适的参数改善焊接空洞问题。得出温度曲线是影响焊接空洞大小的最显著因素,真空焊通过对工艺曲线、压力、甲酸的控制、载体粗糙度、气氛保护的分析,找到了各自合适的参数改善焊接空洞问题,得出工艺曲线、气氛保护是影响焊接空洞大小的最显著因素。
[Abstract]:In the era of high speed development of electronic industry, with the development of thick film hybrid integrated circuit towards high performance, high reliability, miniaturization, high uniformity and low cost. The assembly technology and process of thick film hybrid circuit are required more and more. In the thick film hybrid integrated circuit, the power component is the core device. It determines the performance and thermal response of thick film power assembly. In the assembly of thick film power assembly, the main problem is that there are more voids in welding devices. Therefore, the heat produced when working can not be effectively divergent, which ultimately makes the working temperature of the device high and reduces its service life. Even some parts cause voltage breakdown due to high temperature. There are many factors that affect the cavity. This paper reviews a large number of literature, combined with the development of domestic and foreign, respectively from the thick film shell, substrate size; Selection of solder composition and status (solder, solder paste); The process curve (vacuum, reduction atmosphere, temperature setting) is used to reduce the porosity of the thick film power device by X-ray, metallographic analysis and shear force test. The result shows that the process temperature curve, the thickness of welding layer and the pressure are analyzed in reflux welding. The temperature curve is the most significant factor affecting the size of the welding cavity. The vacuum welding through the process curve, pressure, formic acid control, carrier roughness. Based on the analysis of the atmosphere protection, the appropriate parameters are found to improve the welding cavity, and the process curve is obtained. The atmosphere protection is the most significant factor affecting the size of the welding cavity.
【学位授予单位】：北华航天工业学院
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN452

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