焊线机键合过程的有限元分析与工艺参数实验

发布时间：2018-01-16 07:38

本文关键词：焊线机键合过程的有限元分析与工艺参数实验　出处：《广东工业大学》2015年硕士论文　论文类型：学位论文

【摘要】：微电子产品的应用越来越广泛,封装是微电子技术的重要组成部分,引线键合实现了封装内部的电气连接,其工艺持续发展变化,以适应微电子封装不断发展的要求。键合过程的工艺参数多,键合过程直接影响了键合界面的成形,从而决定了键合稳定性和键合质量的好坏。本论文针对焊线过程的第一键合点,研究焊线工艺参数对键合质量的影响规律,运用LS-DYNA建立键合界面焊球变形过程的有限元模型,分析瓷嘴接近速度与冲击力的关系及键合界面失效形式,为键合过程工艺参数的合理设置提供参考。论文主要研究内容阐述如下：1.了解课题的研究背景与意义,调研键合工艺参数对焊线质量影响规律的研究现状,针对键合过程对于键合点的形状的要求,研究键合工艺参数对键合界面成形的影响规律。2.利用正交试验方法对多个工艺参数不同水平进行合理组合,研究温度、瓷嘴接近速度、键合压力和超声振动对最终的焊球形状尺寸和键合质量的影响规律。3.针对实验中难以获得键合界面详细变形过程的情况,运用有限元分析软件对键合过程焊球与焊盘变形过程进行模拟仿真,获得金球和焊盘在键合过程中焊球与焊盘的应力应变分布及变化规律,为焊盘结构设计,规避应力集中提供理论支持。4.在分析键合界面失效形式的基础上,通过构建焊球冲击焊盘过程的有限元模型,研究键合过程接近速度与冲击力的关系,为键合过程工艺参数的合理设置提供参考。
[Abstract]:The application of microelectronic products is more and more extensive. Packaging is an important part of microelectronics technology. Lead bonding realizes the electrical connection inside the package, and its process continues to change. In order to meet the requirements of the continuous development of microelectronic packaging, the bonding process has a lot of process parameters, and the bonding process directly affects the formation of the bonding interface. Therefore, the stability and quality of bonding are determined. In this paper, the influence of welding process parameters on bonding quality is studied according to the first bonding point in the welding process. The finite element model of bonding interface welding ball deformation process was established by using LS-DYNA. The relationship between the close velocity of ceramic nozzle and impact force and the failure mode of bonding interface were analyzed. The main contents of this paper are as follows: 1. Understand the research background and significance of the subject, investigate the research status of bonding process parameters on the quality of welding line. According to the requirements of bonding process for the shape of bonding point, the influence of bonding process parameters on bonding interface forming is studied. 2. The orthogonal test method is used to combine several process parameters at different levels. 2. The effects of temperature, ceramic nozzle approach velocity, bonding pressure and ultrasonic vibration on the shape, size and bonding quality of the final welding ball are studied. 3. The detailed deformation process of the bonding interface is difficult to obtain in the experiment. The finite element analysis software is used to simulate the deformation process of the ball and pad during bonding process. The stress and strain distribution and variation law of the ball and pad in the bonding process are obtained, and the structure of the pad is designed. On the basis of analyzing the failure form of bonding interface, the relationship between the close velocity and the impact force of bonding process is studied by constructing the finite element model of the impact pad process. It provides a reference for the reasonable setting of the process parameters in the bonding process.
【学位授予单位】：广东工业大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405

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