集成电路板焊点缺陷的机器视觉检测方法

发布时间：2018-01-16 15:06

本文关键词：集成电路板焊点缺陷的机器视觉检测方法　出处：《天津科技大学》2015年硕士论文　论文类型：学位论文

【摘要】：随着电子制造业的高速发展,集成电路板的应用日益广泛。如何快速、高效的检测产品质量,是企业面临的一个重大问题。自动化检测技术代替人工检测成为必然的趋势。然而对于不同的应用背景和检测对象,检测方法也各有差异,因此应有针对性的设计检测系统。本课题中的检测对象为车载受信机电路板,该电路板具有一定的特殊性。它是在经过表面贴装(SMT-Surface Mount Technology)后的印刷电路板(PCB-Printed Circuit Board)上又集成了天线、天线支架等部件,造成了元器件之间的空间遮挡。在此条件下,对芯片引脚焊接质量进行检测时,企业采用的方法仍然是人工目检,其效率低、准确率不足,且目前的集成电路板检测装置难以被直接使用。本文针对上述实际问题,结合企业的生产需求,确定了基于机器视觉原理的车载受信机电路版焊点缺陷检测方法。本文对车载电路板焊点缺陷的视觉检测方法进行了而深入的研究,根据电路板元器件分布的特殊空间结构,设计了满足要求的该类电路板焊点缺陷检测系统。通过实验验证了该方法的通用性和可行性。本文的主要研究内容有以下几个方面：1.总结集成电路板焊点缺陷检测方法,结合车载电路板元器件空间分布的特殊性,研究了针对该类型电路板的视觉检测方法,并通过实验得到验证。2.设计了基于固高GT-400三自由度运动平台的自动检测装置,通过调整电路板的位置,对不同焊点进行检测。3.使用机器视觉检测缺陷时,相机与芯片引脚平面呈一定的角度,由于景深的存在使得部分引脚出现离焦模糊现象。通过分析,推导出了合理的拍摄角度,可拍摄到清晰的全部引脚焊点图像,并通过实验进行验证。4.设计了检测系统的软件部分,实现运动控制和图像采集与处理。其中包括：轨迹学习模块、在线处理模块等。
[Abstract]:With the rapid development of electronic manufacturing industry, the application of integrated circuit board is more and more extensive. How to detect the product quality quickly and efficiently. Automatic detection technology instead of manual detection has become an inevitable trend. However, for different application backgrounds and detection objects, the detection methods are different. Therefore, there should be a targeted design of the detection system. The subject of this subject is the on-board circuit board. The circuit board has some particularity. It is a printed circuit board (PCB) after the surface mount of SMT-Surface Mount technology (SMT-Surface Mount technology). The antenna is integrated on the PCB-Printed Circuit board. Antenna support and other components, resulting in a spatial occlusion between components. Under this condition, when the chip pin welding quality detection, the enterprise still uses artificial inspection, its efficiency is low, the accuracy is not enough. And the current integrated circuit board detection device is difficult to be directly used. This paper aims at the above practical problems, combined with the production needs of enterprises. Based on the principle of machine vision, the detection method of solder joint defect in the electromechanical circuit plate of vehicle is determined. In this paper, the visual detection method of solder joint defect of on-board circuit board is studied deeply. According to the special spatial structure of circuit board components. The testing system of solder joint defect of this kind of circuit board is designed, and the generality and feasibility of the method are verified by experiments. The main research contents of this paper are as follows:. 1. Summarize the detection method of solder joint defect in integrated circuit board. Combined with the particularity of the spatial distribution of the components of the on-board circuit board, the visual detection method for this type of circuit board is studied. And through the experiment to verify .2.designed based on the fixed height GT-400 three-degree-of-freedom motion platform automatic detection device, by adjusting the position of the circuit board. When using machine vision to detect defects, the plane of camera and chip pin is at a certain angle, because of the existence of depth of field, some pins appear defocus blur phenomenon. The reasonable shooting angle is deduced and all the pin solder joint images can be captured clearly. Finally, the software part of the detection system is designed. Motion control and image acquisition and processing, including: trajectory learning module, online processing module and so on.
【学位授予单位】：天津科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN407

【相似文献】