基于微观界面粘附机理的晶圆传输机械手控制方法研究

发布时间：2018-01-20 02:55

本文关键词： 晶圆传输机械手粘附机理位姿调节运动学同步控制　出处：《上海工程技术大学》2016年硕士论文　论文类型：学位论文

【摘要】：集成电路装备制造产业是国家大力发展的高新技术之一,对于推动国民经济和社会信息化发展有着重要意义。晶圆传输机械手是集成电路制造装备的重要组成部分,主要承担着晶圆的精确定位与快速、稳定的传输任务。目前制约晶圆传输效率的重要原因是传输界面间无法产生足够大的摩擦力,本文分析了晶圆传输机械手的研究现状,在研究微观界面粘附理论的基础上,提出了机械手末端执行器在位姿调节下实现高加速晶圆传输的新方法;对所建立的高加速晶圆传输平台的运动学、动力学进行求解;建立传输平台的三维模型,完成运动学仿真的验证分析;基于晶圆传输面的粘附特性对高加速晶圆传输运动平台的控制方法进行了研究。主要工作有:在机械手末端执行器与晶圆的微观粘附机理方面,首先考虑机械手末端执行器的本体结构,分析典型的摩擦模型与微观接触理论;考虑摩擦力的微观作用力部分计算传输界面晶圆的摩擦力,根据JKR弹性接触理论建立晶圆接触面粘附力的数学模型;分别求解分析机械手末端执行器水平位姿和倾斜位姿下的摩擦及粘附特性,得出接触面粘附力随位姿角度的变化规律;进而仿真分析晶圆传输加速度与末端执行器位姿倾角的关系,在此基础上研究实现高加速晶圆传输的有效方法。经过系统分析实现高加速晶圆传输所需的运动结构以及调节晶圆传输界面粘附力的方法,建立高加速晶圆传输运动及末端位姿调节的平台模型。首先建立高加速晶圆传输运动平台的坐标系,分析原点移动坐标系的变换方程;进而在所建坐标系下研究高加速晶圆传输的运动学模型、进行运动学求解;并根据机构的动力学基础完成动力学分析;应用UG建立运动系统各零部件的三维模型,完成了晶圆传输运动平台的装配,采用ADAMS仿真软件对高加速晶圆传输平台进行运动学仿真,仿真结果表明应用末端执行器位姿调节的方法可以有效的提高晶圆传输的加速度,实现晶圆快速稳定的传输。根据高加速晶圆传输运动系统的要求,研究高加速运动平台的控制方法。首先分析常见的同步运动控制结构,确定合理的高加速晶圆传输运动平台的控制策略;运动平台提供水平方向的高加速直线运动,同时驱动末端执行器实现位姿角度的调节;建立基于加速度调节的主从同步控制结构,保证高加速晶圆传输过程中加速度值与末端执行器位姿转角的同步协调;满足晶圆传输过程高粘附与释放晶圆低粘附的运动要求,实现晶圆快速可靠的传输。
[Abstract]:Integrated circuit equipment manufacturing industry is one of the national high-tech development, is of great importance for promoting the development of national economy and social informationization. The wafer transfer manipulator is an important part of the integrated circuit manufacturing equipment, is mainly responsible for the wafer precisely and quickly, transmission stability. An important reason is restricting the efficiency of wafer transfer is the transmission interface cannot produce enough friction, this paper analyzes the research status of wafer transfer manipulator, based on the study of micro adhesion theory, put forward the manipulator end execution of a new method of implementing high speed wafer transmission device in the posture adjustment; based on the high speed wafer transmission platform kinematics to solve the three-dimensional model, dynamics; establish the transmission platform, analysis of kinematics simulation verification is complete; the adhesion characteristics based on wafer transmission The control method of high speed wafer transfer motion platform are studied. The main work is: in the aspect of Micro Adhesion Mechanism of the end effector and the wafer, first consider the body structure of the end effector, analysis of friction model and microcosmic contact theory typical; calculation of friction force transmission interface considering the micro force part of the friction wafer and according to the mathematical model of JKR elastic contact theory to establish the wafer contact surface adhesion force; friction analysis respectively solve the end effector level posture and tilt position and adhesion properties, changes with the position angle of the contact surface and the adhesive force; simulation analysis of actuator position angle relationship of wafer transmission with the acceleration of the end, on the basis of the effective method to realize the high acceleration of wafer transmission. After the system analysis to achieve high accelerating wafer transfer required for transport The method of adjusting the wafer transfer structure and interfacial adhesion, the establishment of high acceleration platform model transmission movement wafer and end pose adjustment. Firstly, high speed wafer transfer motion platform coordinate system, analysis of moving coordinate transformation equation of origin; and in the coordinate study on kinematic model of high acceleration wafer transmission system, kinematics solution; and according to the dynamic analysis of complete dynamics based mechanism; 3D model is built by using UG components of the motor system, complete assembly of wafer transfer motion platform, using ADAMS simulation software for kinematics simulation of high acceleration wafer transmission platform, simulation results show that the application of the end effector pose adjustment method can effectively the increase of wafer transmission acceleration, to achieve fast and stable wafer transfer. According to the high speed movement wafer transmission system, research The acceleration control method of motion platform. Firstly, analysis of common synchronous motion control structure, determine the control strategy of high acceleration wafer transfer motion platform is reasonable; the movement platform provides horizontal high speed linear motion, while driving the end effector can adjust the pose angle; establish synchronization control structure based on master-slave acceleration adjustment, ensure acceleration high speed wafer transfer value in the process of synchronization and the end effector pose angle; meet the wafer transfer process of high adhesion and low adhesion release wafer movement, to achieve fast and reliable transmission of wafer.

【学位授予单位】：上海工程技术大学
【学位级别】：硕士
【学位授予年份】：2016
【分类号】：TN405

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