一种电子封装用导电银胶的制备与性能研究

发布时间：2018-01-21 12:41

本文关键词： 环氧树脂导电银胶电子封装　出处：《西华大学》2015年硕士论文　论文类型：学位论文

【摘要】：本论文研究了一种电子封装用导电银胶的制备,自主研发了一种电子封装用导电胶,对代替铅锡焊料、保护环境、满足电子电路集成化封装有着重要的意义,并对自主研制的导电银胶进行了性能测试,满足生产用。首先叙述了导电胶的各组成成分和各组成成分的选取原则,确定了导电银胶的成分为:环氧树脂(E51型)作为基体树脂、酸酐类化合物(甲基纳迪克酸酐)作为固化剂选、咪唑类化合物(2-已基-4甲基咪唑)作为促进剂、1~3μm片状银粉作为导电填料。确定了导电银胶的最佳配比:树脂(E51型环氧树脂):固化剂(甲基纳迪克酸酐):导电填料(1~3μm片状银粉):促进剂(2-已基-4甲基咪唑)=100:80:126:0.6。讨论了基体树脂的固化性能,测定其固化时间;通过实验分别研究了促进剂(2-乙基-4甲基咪唑)对固化性能的影响、银粉填充量对导电银胶性能的影响、助剂对导电胶性能的影响、高温对导电胶电性能的影响、导电促进剂(二乙二醇丁醚)对导电胶电性能的影响、增韧剂对导电胶电性能的影响、稀释剂对导电银胶丝网印刷技术的影响;研究表明:促进剂(2-乙基-4甲基咪唑)量多,固化时间就少,同时剪切强度也随之下降;导电银胶的电学性能和力学性能与银粉填充量有很大关系,银粉填充量越大,导电银胶体积电阻率越低,但同时拉伸剪切强度下降;二乙二醇丁醚(DBGE)的加入有利于提高导电银胶的导电性能,但导电银胶的拉伸剪切强度却连续下降;随着增韧剂量的不断增加,导电银胶的剪切强度不断增加,但导电性能呈现递减趋势;导电银胶通过添加偶联剂、促进剂、稀释剂可以大大提高导电银胶的导电性能;通过实验验证了自制的导电银胶具有耐高温性能;研究了导电银胶的制备工艺和流程,测试了自主研发的导电银胶的电学性能,测量体积电阻率为:7.2×10-4??cm;利用材料力学实验机测定了自制导电银胶的拉伸剪切强度,剪切强度达14.6(MPa),基本满足生产用。通过此次导电银胶的制备与性能研究项目,为更进一步研究导电银胶奠定了实验和理论基础。
[Abstract]:This paper studies the preparation of a conductive silver gel for electronic packaging, and develops a conductive adhesive for electronic packaging, which is of great significance to replace lead and tin solder, protect the environment and meet the requirements of integrated electronic circuit packaging. The properties of the conductive silver adhesive developed by ourselves were tested to meet the needs of production. Firstly, the composition of the conductive adhesive and the selection principle of each component were described. The composition of conductive silver adhesive was determined as follows: epoxy resin E51) as matrix resin and acid anhydride compound (methyl Nadidiic anhydride) as curing agent. Imidazole compounds (2-hexyl-4-methyl imidazole) were used as accelerators. The best proportion of conductive silver colloid was determined as follows: resin E51 type epoxy resin: curing agent (methyl Nadeic anhydride: conductive filler 1 1 渭 m flake silver powder). The curing properties of the matrix resin were discussed. The curing time was determined. The effects of accelerator 2-ethyl-4-methylimidazole) on the curing properties, the effect of the amount of silver powder on the properties of conductive silver adhesives and the effect of additives on the properties of conductive adhesives were studied. The effect of high temperature on the electrical properties of conductive adhesive, the effect of conductive accelerator (diethylene glycol butyl ether) on the electrical properties of conductive adhesive, the effect of toughening agent on electrical properties of conductive adhesive, and the influence of diluent on screen printing technology of conductive silver gel; The results show that the curing time is less and the shear strength decreases with the increase of the amount of accelerator 2-ethyl-4-methylimidazole. The electrical and mechanical properties of conductive silver gel are related to the content of silver powder. The larger the amount of silver powder is, the lower the volume resistivity of conductive silver colloid is, but the tensile shear strength decreases at the same time. The addition of diethylene glycol butyl ether (DBGE) can improve the conductivity of conductive silver gel, but the tensile shear strength of conductive silver adhesive decreases continuously. With the increasing of the amount of toughening agent, the shear strength of conductive silver adhesive is increasing, but the conductivity is decreasing. Through adding coupling agent, accelerator and diluent, conductive silver adhesive can greatly improve its conductive property. It is proved by experiments that the self-made conductive silver adhesive has high temperature resistance. The preparation process and process of conductive silver colloid were studied. The electrical properties of the conductive silver gel developed by ourselves were tested. The volume resistivity was measured to be 7. 7 脳 10 ~ (-4)? ? Cm; The tensile shear strength of self-made conductive silver adhesive was measured by means of material mechanics test machine. The shear strength reached 14.6 mpa, which was basically suitable for production. The preparation and properties of the conductive silver adhesive were studied. It lays an experimental and theoretical foundation for the further study of conductive silver colloid.
【学位授予单位】：西华大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN05

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