金丝引线键合工艺参数对键合质量影响规律的研究

发布时间：2018-01-22 19:45

本文关键词： 引线键合热超声键合球键合正交试验法多元线性回归　出处：《内蒙古工业大学》2016年硕士论文　论文类型：学位论文

【摘要】：金丝引线键合是一种通过超声振动和键合力的共同作用,在低温或无加热情况下,将金丝引线分别键合到芯片焊盘和基板引脚上,以实现芯片与基板电路间物理互连的方法。超声引线键合是当前最重要的微电子封装技术之一,在IC后封装中,90%以上的封装均采用引线键合互连技术。由于我国封装技术研究起步较晚,关键技术掌握不足,缺乏工艺的数据积累,因此对引线键合工艺参数进行研究,分析影响键合质量的关键参数,发现归纳影响键合质量的规律,都具有重要的理论意义和工程应用价值。根据金丝引线键合的键合原理及超声金丝球焊机的工作过程,本论文选取了超声时间、超声功率、烧球时间、烧球电流、键合压力、键合温度六个影响因素,作为对金丝引线键合质量具有影响的工艺参数进行研究。根据金丝引线键合的工艺过程,首先进行了玻璃-硅阳极直接键合试验,研究键合时间,接触面积以及温度对键合质量的影响规律,选取了最佳键合条件,为金丝引线键合试验做准备。其次,由于对金丝引线键合质量具有影响的工艺参数较多,选用六因素五水平的正交试验法进行研究试验。并选取铜基底和硅基底两组对比试验,研究不同基底条件下,工艺参数对键合质量影响是否一致。最后,根据多元线性回归原理,依据最小二乘法原理利用MATLAB软件对试验数据进行线性拟合,并验证拟合结果的合理性,运用残差法对拟合的多元线性回归方程进行修正,并利用所拟合方程对所选条件下键合率的范围进行估计和预测。通过对金丝引线键合工艺参数的研究可知,影响键合质量的因素有很多,键合温度对键合质量的影响最为显著,其他影响因素的影响水平略有差异。超声功率对金丝—铜影响相比较大,超声时间、烧球电流对金丝—硅影响相比较大。根据数据和最小二乘法拟合多元线性方程为回归模型,利用拟合多元线性方程估计和预测最优值条件下键合率的取值区间具有合理性。研究结果表明,加工时选取恰当的工艺参数,可提高键合效率,具有重要的工程应用价值。
[Abstract]:The gold wire lead bonding is a kind of joint action of ultrasonic vibration and bonding force. Under the condition of low temperature or no heating, the gold wire lead is bonded to the chip pad and the substrate pin respectively. Ultrasonic lead bonding is one of the most important microelectronic packaging technologies in the post-IC packaging. More than 90% packaging uses lead bonding interconnection technology. Because of the late start of packaging technology in China, the lack of key technology, lack of process data accumulation, so the lead bonding process parameters are studied. The key parameters affecting bonding quality are analyzed and the law of inductive effect on bonding quality is found. According to the bonding principle of gold wire lead and the working process of ultrasonic gold wire ball welding machine, this paper selects ultrasonic time, ultrasonic power, firing time. Six influencing factors, such as firing current, bonding pressure and bonding temperature, are studied as the process parameters which have influence on the bonding quality of gold wire lead, according to the process of gold wire lead bonding. The direct bonding test of glass-silicon anode was carried out, and the influence of bonding time, contact area and temperature on the bonding quality was studied. The optimum bonding conditions were selected to prepare for the gold wire bonding test. Because there are many technological parameters that affect the bonding quality of gold wire lead, the orthogonal test method with six factors and five levels is used to carry out the research, and two groups of comparative tests are selected, copper substrate and silicon substrate. The effect of process parameters on bonding quality was studied under different substrate conditions. Finally, according to the principle of multivariate linear regression. According to the principle of least square method, the test data are fitted by MATLAB software, and the rationality of the fitting results is verified. The residual method is used to modify the multivariate linear regression equation. The range of bonding rate under the selected conditions is estimated and predicted by using the fitting equation. Through the study of the process parameters of gold wire bonding, it can be seen that there are many factors that affect the bonding quality. The effect of bonding temperature on bonding quality is most significant, and the influence level of other factors is slightly different. Ultrasonic power has a greater effect on gold wire and copper, and ultrasonic time. The effect of firing current on gold wire and silicon is greater. The regression model is fitted by multivariate linear equation according to the data and the least square method. It is reasonable to use fitting multivariate linear equation to estimate and predict the value interval of bonding rate under optimal value. The research results show that the bonding efficiency can be improved by selecting appropriate processing parameters. It has important engineering application value.
【学位授予单位】：内蒙古工业大学
【学位级别】：硕士
【学位授予年份】：2016
【分类号】：TN405

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