塑性形变对微电子封装热应力的影响

发布时间：2018-02-02 03:31

本文关键词： 塑性形变微电子封装热应力有限元　出处：《固体电子学研究与进展》2017年03期 　论文类型：期刊论文

【摘要】：采用ABAQUS有限元软件,对封装工艺进行研究,建立金属外壳封装热应力仿真模型。在典型的弹塑性力学模拟理论的基础上,将金属塑性行为引入到该外壳封装热应力模拟计算中,对比了引入金属塑性行为前后外壳封装热应力分布及大小变化,系统地分析了金属塑性行为对外壳热应力分布和形式的影响机制。结果显示,未考虑金属塑性行为时,计算的封装最大应力远超出金属的屈服应力值和陶瓷的断裂强度,引入其塑性行为后外壳的最大等效应力下降了约23%,同时陶瓷件所受的最大拉应力下降了约21%,表明引入塑性行为可有效提升封装应力仿真的计算精度。
[Abstract]:Based on the typical elastic-plastic mechanics simulation theory, the thermal stress simulation model of metal shell package is established by using ABAQUS finite element software. The plastic behavior of metal was introduced into the thermal stress simulation of the shell package, and the thermal stress distribution and the change of the size of the shell were compared before and after the metal plastic behavior was introduced. The mechanism of the influence of metal plastic behavior on the thermal stress distribution and form of the shell is systematically analyzed. The results show that the plastic behavior of the metal is not taken into account. The calculated maximum stress of the package far exceeds the yield stress of the metal and the fracture strength of the ceramics, and the maximum equivalent stress of the shell decreases by about 23% when the plastic behavior is introduced. At the same time, the maximum tensile stress of ceramic parts is reduced by about 21%, which indicates that plastic behavior can effectively improve the accuracy of package stress simulation.
【作者单位】：南京铁道职业技术学院;
【基金】：江苏省轨道交通控制工程技术研究中心开放基金项目(KFJ1504)
【分类号】：TN405
【正文快照】： 引言随着微电子器件不断向高集成、小型化、多功能及长寿命方向发展,其可靠性要求的提高和失效研究成为微电子封装领域的重要研究热点。由于材料热失配效应,微电子封装过程不可避免地存在热应力,若热应力过大会使导致材料微裂纹、变形,影响***器件长期可靠性,甚至直接导致器件

【参考文献】