空气轴承电主轴动力学特性分析

发布时间：2018-02-07 15:03

本文关键词： 硅片磨削电主轴空气轴承转子动力学气体润滑理论　出处：《东南大学》2015年博士论文　论文类型：学位论文

【摘要】：随着集成电路制造技术的飞速发展,为了提高集成电路芯片产量,降低制造成本,作为集成电路原始材料的硅片趋向大直径化。另一方面,为满足集成电路芯片封装的需要,则要求芯片厚度薄型化。目前国际上主流的硅片磨床加工直径为300mm,而国内尚未突破300mm大尺寸硅片的超精密磨削技术,其主要原因在于缺乏大尺寸硅片磨削专用电主轴的动态设计技术。针对这一问题,论文以Φ300mm硅片超精密磨削技术为背景,围绕空气轴承电主轴静动态设计方法开展研究,主要工作如下：(1)基于可压缩流体润滑理论,考虑主轴转子的平移运动和倾斜运动,采用线性摄动法推导了径向空气轴承和止推空气轴承气体润滑静动态雷诺方程；采用有限差分法和牛顿迭代法,推导了空气轴承静动态参数的计算方法,为后续分析主轴的静动态特性提供理论基础；(2)基于刚体动力学理论,考虑主轴转子在x、y、z方向的平移运动以及绕x、y轴的倾斜运动,建立了主轴转子系统五自由度耦合动力学模型,推导了主轴不平衡响应、磨削力激励响应以及稳定性的计算方法,并分析了硅片磨削专用电主轴在设计工况下的动力学特性；(3)采用弹簧加载法,研制了用于测量主轴轴向静刚度和径向静刚度的电主轴静态性能测试试验台；利用主轴误差分析仪,研制了主轴回转误差测试试验台；(4)研究结果表明,用于安装砂轮的磨削电主轴其轴向静刚度和径向静刚度理论计算值分别为：520N/1μm和122N/μm,与试验值500N/μmn和100N/μm相吻合；用于夹持硅片的旋转工作台电主轴其轴向静刚度理论计算值为1000N/μmm,也与试验结果950N/μm相吻合。本文建立了空气轴承电主轴静动态特性理论分析模型,研制了电主轴静动态参数测试试验台,解决了硅片磨削专用电主轴设计的关键技术,为我国大尺寸硅片磨床关键功能部件的国产化奠定了基础。
[Abstract]:With the rapid development of integrated circuit manufacturing technology, in order to increase the output of integrated circuit chip and reduce the manufacturing cost, the silicon chip, as the original material of integrated circuit, tends to be large-diameter, on the other hand, in order to meet the needs of IC chip packaging, At present, the processing diameter of the mainstream silicon wafer is 300mm, but the domestic ultra-precision grinding technology of 300mm large size silicon wafer has not been broken through. The main reason lies in the lack of dynamic design technology of special motorized spindle for large size silicon wafer grinding. In view of this problem, this paper focuses on the static and dynamic design method of air bearing motor spindle based on 桅 300mm silicon wafer ultra-precision grinding technology. The main work is as follows: (1) based on compressible fluid lubrication theory, the static and dynamic Reynolds equations of gas lubrication for radial air bearing and thrust air bearing are derived by linear perturbation method. By using the finite difference method and Newton iteration method, the calculation method of static and dynamic parameters of air bearing is derived, which provides a theoretical basis for the subsequent analysis of the static and dynamic characteristics of the spindle, which is based on the rigid body dynamics theory. Considering the translational motion of the spindle rotor in the direction of xyniz and the tilt motion around the xy axis, the coupling dynamic model of the spindle rotor system with five degrees of freedom is established, and the calculation methods of the unbalance response of the spindle, the excitation response of the grinding force and the stability are derived. The dynamic characteristics of the special motorized spindle for silicon wafer grinding under the design condition are analyzed. The static performance test bench of the motorized spindle used to measure the axial and radial static stiffness of the spindle is developed by using the spring loading method. With the aid of spindle error analyzer, the research results show that, The theoretical calculation values of axial and radial static stiffness of grinding motorized spindle used for installing grinding wheel are: 1 渭 m and 122 N / 渭 m, respectively, which are in agreement with the experimental values of 500N / 渭 mn and 100N / 渭 m. The theoretical calculation value of axial static stiffness of the motorized spindle of rotary table used for gripping silicon wafer is 1000N / 渭 mm, which is in agreement with the test result 950N / 渭 m. A theoretical analysis model of static and dynamic characteristics of the motorized spindle of air bearing is established in this paper. The static and dynamic parameters test rig of motorized spindle is developed, which solves the key technology of the design of motorized spindle for silicon wafer grinding, and lays a foundation for the localization of key functional components of large size silicon wafer grinding machine in China.
【学位授予单位】：东南大学
【学位级别】：博士
【学位授予年份】：2015
【分类号】：TN405

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