大规模集成电路封装用环氧模塑料的制备

发布时间：2018-02-21 08:14

本文关键词： 环氧模塑料联苯环氧树脂大规模集成电路封装固化行为介电性能弯曲性能　出处：《北京化工大学》2015年硕士论文　论文类型：学位论文

【摘要】：本文对大规模集成电路封装用环氧模塑料的的配方、制备工艺及性能进行研究。根据本实验需求,选出了一套实验制备环氧模塑料的设备,设计加工了压饼模具、螺旋流动模具、弯曲及阻燃性能模具、线膨胀系数模具及介电性能模具。对环氧模塑料样品EC-15L和EME-1100中各组分的种类与含量进行了分析,EC-15L中填充了约79%粒径在1-50μm的熔融不规则型硅微粉,EME-1100中填充了约83%粒径在1-10μm的部分结晶的不规则型硅微粉,基体树脂为邻甲酚醛环氧树脂,并添加了Sb203作为阻燃剂。选取邻甲酚醛环氧树脂为基体树脂,分别以三苯基膦和2-甲基咪唑为固化促进剂制备集成电路封装用环氧模塑料,并对固化物进行了TMA、DMA测试。相比于2-甲基咪唑体系,使用三苯基膦的体系固化反应程度较低,交联结构不完全,因而表现出较低的玻璃化转变温度。以非等温DSC法研究了邻甲酚醛环氧模塑料和联苯环氧模塑料的固化行为,酚醛树脂用量高的体系,其反应的固化活化能明显小于酚醛树脂用量低的体系；促进剂为2-甲基咪唑的体系其固化活化能较低；2-甲基咪唑用量高的体系,其反应的固化活化能明显小于2-甲基咪唑用量低的体系,使用较长的预固化时间,在后期固化过程当中放出的热量较小；纯联苯环氧树脂的体系固化活化能较低,随着联苯环氧树脂含量的增加,邻甲酚醛环氧树脂含量的降低,固化体系反应活化能降低,但凝胶化时间延长。硅微粉含量的增加会导致环氧模塑料的流动性变差；增加样条制备时的注射压力可以提高其密度、弯曲模量和弯曲强度,增加后固化时间,样品的机械性能有显著提高；填料可提高聚合物基体材料的玻璃化转变温度、耐热性能以及力学性能；联苯环氧树脂制备的环氧模塑料萃取液PH值呈弱酸性,Cl-含量低于7×10-5mol/l;样条密度的增大吸水率减小,本实验中各体系的吸水率均小于1%,具有良好的耐湿性能；体系的介电性能均达到要求。
[Abstract]:In this paper, the formulation, preparation process and properties of epoxy moulding plastics for large scale integrated circuit packaging are studied. According to the requirements of this experiment, a set of experimental equipment for preparing epoxy moulding plastics is selected, and the die for pressing cake is designed and processed. Spiral flow mould, bending and flame-retardant mould, Linear expansion coefficient mould and dielectric properties mould. Analysis of the types and contents of components in EC-15L and EME-1100 of epoxy moulding plastics samples filled with about 83% particles in the melt irregular silicon powder EME-1100 with about 79% diameters of 1-50 渭 m in EEC-15L. Partially crystallized irregular silicon powder with diameters of 1-10 渭 m, The base resin was o-cresol formaldehyde epoxy resin, and Sb203 was added as flame retardant. The epoxy resin for IC packaging was prepared by using triphenylphosphine and 2-methyl imidazole as curing accelerators, respectively, in which o-cresol aldehyde epoxy resin was used as matrix resin, and 2-methylimidazole was used as curing accelerator. Compared with 2-methylimidazole system, the curing reaction degree of the system with triphenylphosphine was lower and the crosslinking structure was not complete. The curing behavior of o-cresol formaldehyde epoxy moulding plastics and biphenyl epoxy moulding plastics was studied by non-isothermal DSC method, and the system with high content of phenolic resin was used to study the curing behavior of o-cresol formaldehyde epoxy moulding plastics and biphenyl epoxy moulding plastics. The curing activation energy of the reaction was obviously lower than that of the system with low amount of phenolic resin, and the system with 2-methylimidazole as accelerator had a lower curing activation energy than that with high dosage of 2-methylimidazole. The curing activation energy of the reaction is obviously lower than that of the system with low dosage of 2-methylimidazole, and the heat released during the later curing process is smaller when the curing time is longer, and the curing activation energy of the pure biphenyl epoxy resin system is lower than that of the pure biphenyl epoxy resin system. With the increase of the content of biphenyl epoxy resin, the content of o-cresol formaldehyde epoxy resin decreases, the activation energy of curing system decreases, but the gelation time is prolonged. When the injection pressure was increased, the density, flexural modulus and flexural strength of the samples were increased, and the mechanical properties of the samples were significantly improved with the increase of curing time, and the glass transition temperature of the polymer matrix materials could be increased by the filler. Heat resistance and mechanical properties, PH value of epoxy moulding plastic extractant prepared by biphenyl epoxy resin was less than 7 脳 10 ~ (-5) mol / l, water absorption decreased with the increase of spline density. In this experiment, the water absorption of each system is less than 1, and the system has good moisture resistance, and the dielectric properties of the system meet the requirements.
【学位授予单位】：北京化工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN47

【参考文献】