伺服控制系统SOC芯片功能分析及测试的研究

发布时间：2018-02-24 18:36

本文关键词： 片上系统 MIPS PCB SOC测试　出处：《合肥工业大学》2015年硕士论文　论文类型：学位论文

【摘要】：片上系统(System On Chip,SOC),是将整个系统集成在一个芯片上。一个完整的SOC系统包括微处理器模块、存储器模块、通信接口模块、ADC/DAC模块、电源模块等。本课题是研究一款支持MIPS 32指令集的SOC芯片,此款芯片主要用于工业控制和数据采集,它作为NCU(数字控制中心)的核心芯片,实现了数据采集、存储、转换、I/O和对机床的位置控制等功能。为了得到性能稳定的SOC芯片,首先要对SOC芯片的内部功能进行透彻分析,然后进行芯片的功能测试,提高最终的良品率。本文是对一个封装成品芯片进行功能测试,主要思想是根据芯片的具体功能,自主设计一个测试电路板,通过示波器、逻辑分析仪测试其内部功能。本论文首先详细分析此款SOC芯片内部模块的体系结构、性能指标和接口设计,包括CPU处理器、Nand Flash控制器、PWM控制器、DDR2控制器、12C接口、中断控制、SPI接口、RTC控制器、Watchdog、GPIO寄存器等模块的结构图、时序图、寄存器定义和引脚功能说明,在此基础上,根据此款芯片自身特点,利用Altium Designer winter 10设计外围测试电路和芯片选型,包括测试板的电源电路、SDRAM电路、复位电路、时钟电路和Flash存储器电路、LED电路设计,进而完成原理图设计和PCB设计,制版和焊接电路板。最后完成测试电路板实物的软硬件调试,借助示波器观察测试板部分模块的波形。先对SOC芯片内部DAC模块和4路PWM模块的波形测试,然后用软件测试了SOC芯片内部Flash的读写功能、DDR2存储器的拷贝、数学运算的速度和USB访问速度。通过对测试结果比对分析,验证芯片内部这五个模块功能基本符合要求,可以流片生产。
[Abstract]:The system on chip system on chip is to integrate the whole system on a chip. A complete SOC system includes microprocessor module, memory module, communication interface module and ADC / DAC module. This topic is to study a SOC chip which supports MIPS 32 instruction set. This chip is mainly used for industrial control and data acquisition. As the core chip of MIPS, it realizes data acquisition and storage. In order to get a stable SOC chip, the internal function of the SOC chip should be thoroughly analyzed, and then the functional test of the chip should be carried out. The main idea of this paper is to design a test circuit board according to the specific function of the chip, and design a test circuit board by oscilloscope. In this paper, the architecture, performance index and interface design of the internal module of the SOC chip are analyzed in detail, including the CPU processor and Flash controller / Flash controller / DDR2 controller / 12C interface. The structure diagram, sequence diagram, register definition and pin function of the Altium Designer winter 10 are used to design the peripheral test circuit and chip type selection according to the characteristics of the chip. It includes power supply circuit of test board, reset circuit, clock circuit and Flash memory circuit, and then completes schematic design and PCB design, plate making and welding circuit board. Finally, hardware and software debugging of test circuit board is completed. With the help of oscilloscope to observe the waveform of some modules of the test board, the waveform of the DAC module and four PWM modules inside the SOC chip are tested first, and then the copy of DDR2 memory is tested by software, which is the reading and writing function of the Flash inside the SOC chip. Through the comparison and analysis of the test results, it is verified that the functions of the five modules in the chip basically meet the requirements, and the flow sheet can be produced.
【学位授予单位】：合肥工业大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN407

【相似文献】