晶硅片切割用水基切割液摩擦学性能的研究

发布时间：2018-02-28 13:02

本文关键词： 切割液聚乙二醇摩擦学性能　出处：《人工晶体学报》2017年07期 　论文类型：期刊论文

【摘要】：重点研究了晶硅片切割用水基切割液中润滑剂的摩擦性能影响因素。选用低分子量的聚乙二醇(PEG)作为润滑剂,研究了不同分子量PEG作为润滑剂的摩擦学性能。在使用PEG300作为水基切割液润滑剂的情况下,相比纯水可减小硅片表面的粗糙度达86.51%;磨损体积可以减少50%,磨损表面磨屑变少。
[Abstract]:The factors affecting the friction properties of the lubricant in the water base cutting solution for wafer cutting were studied. The low molecular weight polyethylene glycol (PEG) was used as the lubricant. The tribological properties of PEG with different molecular weight as lubricant were studied. When PEG300 was used as lubricant of water-based cutting liquid, the roughness of silicon wafer surface was reduced to 86.51, and the wear volume was reduced by 50%, and the wear debris was decreased.
【作者单位】：河南易成新能源股份有限公司;河南大学纳米材料功能研究中心;
【分类号】：TN305.1

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