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3mm波段上变频组件的研制

发布时间:2018-03-09 20:36

  本文选题:毫米波 切入点:3mm 出处:《电子科技大学》2015年硕士论文 论文类型:学位论文


【摘要】:随着电磁波频段的日渐拥挤,毫米波技术将拥有越来越广泛的应用前景。我国目前对毫米波技术的研究处在相对落后的位置,具有十分广阔的发展空间。在整个毫米波系统中,变频组件是对其整体性能有极大影响的重要组成部分。而W波段又是毫米波频谱中重要的窗口频段,基于此,本课题主要使用国产芯片,采用混合集成技术,研制了一个3mm波段上变频组件以及和其配套的本振倍频源。本文的第一章介绍了毫米波的定义、特点、应用,回顾了国内外毫米波T/R组件、毫米波频率源的发展概况。第二章介绍了3mm上变频组件的基本原理和主要技术指标,根据项目指标要求制定了整体方案,并对各单元电路、元器件进行指标分配,元器件选取。第三章完成了上变频组件的设计,包括无源过渡部分,有源芯片选取,腔体和基片设计,电源电路设计以及最终的装配和测试。第四章介绍了毫米波频率源的理论基础和技术指标,根据实际需求制定了倍频链路整体方案,对组件中用到的MMIC芯片进行了介绍。第五章为本振倍频链路的设计和测试,包括vco腔体、基片和电源电路设计,倍频腔体、基片和电源电路设计,和最终的装配测试。第六章为总结及展望,总结了课题设计中的成功之处和不足之处,并对不足的地方提出了改进设想。
[Abstract]:As the frequency band of electromagnetic wave becomes more and more crowded, millimeter wave technology will have more and more extensive application prospects. At present, the research on millimeter wave technology in our country is relatively backward and has a very broad development space. In the whole millimeter wave system, Frequency conversion module is an important part of the whole performance, and W band is an important window frequency band in millimeter wave spectrum. A 3mm band up-conversion module and its matching local oscillator frequency multiplier are developed. In the first chapter of this paper, the definition, characteristics and application of millimeter wave are introduced, and the domestic and foreign millimeter wave T / R modules are reviewed. The development of millimeter-wave frequency source. Chapter two introduces the basic principle and main technical indexes of 3mm up-conversion module. According to the requirements of the project, the overall scheme is established, and the unit circuits and components are allocated. In Chapter 3, the up-conversion module is designed, including passive transition, active chip selection, cavity and substrate design. Power circuit design and final assembly and test. Chapter 4th introduces the theoretical basis and technical specifications of millimeter-wave frequency source, and formulates the overall scheme of frequency doubling link according to the actual demand. This paper introduces the MMIC chip used in the module. Chapter 5th is about the design and test of the local oscillator frequency doubling link, including the design of vco cavity, substrate and power circuit, the design of frequency doubling cavity, substrate and power circuit. Chapter 6th summarizes the successes and shortcomings of the design, and puts forward some suggestions for improvement.
【学位授予单位】:电子科技大学
【学位级别】:硕士
【学位授予年份】:2015
【分类号】:TN015

【参考文献】

相关期刊论文 前1条

1 何庆国,孙静;毫米波倍频上变频功放组件[J];半导体情报;2000年04期



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