3D-TCNoC热均衡片上网络的设计与评估

发布时间：2018-03-22 12:15

本文选题：三维NOC　切入点：热均衡　出处：《西安电子科技大学》2015年硕士论文　论文类型：学位论文

【摘要】：多核处理器芯片随着芯片尺寸的日渐减小,对通信带宽的要求日渐增加。随着TSV技术的日渐发展,制造三维集成电路也逐步成为现实,将其与片上网络的特点相结合,三维片上网络便应运而生。片上网络主要用来满足对性能要求较高、芯片面积要求较严格的电路设计。但是,由于多层堆叠技术中高功耗高密度将会造成三维片上网络的温度过高,因此温度特性的考量也成为了三维片上网络系统设计当中不可忽略的关键问题。本文开展了以下研究:首先,在分析三维片上网络热问题的当前研究现状以及三维片上网络相关的关键技术的基础上,提出了基于3Dmesh交叉开关路由器的热模型。该模型将网络当中的热量来源分为两个部分,其一为路由器本身产生的热量,其二为路由器与路由器之间由于温度差所产生的热量传递,路由器本身产生的热量由路由器的结构所决定,由于温度差产生的热量传递由半导体材料本身及其热阻做决定。整个片上网络的温度模型根据每个路由器t时刻的温度来决定。其次,基于上述热模型,设计了一种新的片上网络热均衡路由算法和带有热量控制器的路由器,通过在热量控制器中加入前述设计的路由器热模型,用于计算当前时刻路由节点的实时温度,本文给出的热均衡路由算法采用基于维序路由的无死锁自适应路由算法,通过避免转弯的方式来避免路由算法当中出现的死锁问题,当数据传输至当前路由节点时,首先根据其目的节点判断其可用的最短路径的可传输方向,之后根据相邻路由器的温度信息将数据传送至周围没有超过温度阈值的路由器,当相邻的路由器的温度都超过阈值时,网络采用zxy维序路由完成数据的传输。最后,建立了3D-TCNOC片上网络的性能评估平台,对该热均衡路由算法进行了性能评估与对比。该评估平台采用了开环互连网络测量的方式:当数据包分组产生后,它们将存储在节点本地输入端口的一个无限深的队列中,然后根据节点路由情况注入到网络当中。这种开环的测量网络的方式将数据产生和网络数据传输隔离开来,即数据产生与网络的工作状态是独立的,该方法可更加准确的测量出网络当中的各项性能指标。实验结果表明相对传统的zxy路由算法呢,本文提出的热均衡3D-TCNOC的路由算法既能有效降低系统的最高温度,同时使温度分布更加均衡。
[Abstract]:With the increasing development of TSV technology, the manufacture of 3D integrated circuits becomes a reality, which combines with the characteristics of on-chip network. Three-dimensional on-chip network emerged as the times require. The on-chip network is mainly used to meet the high performance requirements, chip area requirements more stringent circuit design. Because of the high power consumption and high density in the multilayer stacking technology, the temperature of the 3D on-chip network is too high. Therefore, the consideration of temperature characteristics has also become the key problem in the design of 3D on-chip network system. This paper has carried out the following research: first, Based on the analysis of the current research situation of the 3D on-chip network heat problem and the key technologies related to the 3D on-chip network, a heat model based on 3Dmesh cross-switch router is proposed, which divides the heat source of the network into two parts. One is the heat generated by the router itself, the other is the heat transfer between the router and the router due to the temperature difference. The heat generated by the router itself is determined by the structure of the router. The heat transfer due to the temperature difference is determined by the semiconductor material itself and its thermal resistance. The temperature model of the entire on-chip network is determined by the temperature at t of each router. A new heat equalization routing algorithm for on-chip network and a router with heat controller are designed. By adding the designed router thermal model to the heat controller, the real-time temperature of the routing node at the current time is calculated. The proposed thermal equilibrium routing algorithm uses deadlock-free adaptive routing algorithm based on dimensionally ordered routing to avoid deadlock problems in the routing algorithm by avoiding turning. When the data is transmitted to the current routing node, First, the transmissible direction of the shortest available path is determined according to the destination node, and then the data is transmitted to the surrounding router without exceeding the temperature threshold according to the temperature information of the adjacent router. When the temperature of adjacent routers exceeds the threshold, the network uses zxy dimensional routing to complete the data transmission. Finally, the performance evaluation platform of the 3D-TCNOC on-chip network is established. The performance evaluation and comparison of the thermal equalization routing algorithm are made. The platform adopts the open loop interconnection network measurement method: when packet packets are generated, they will be stored in an infinite queue on the local input port of the node. Then it is injected into the network according to the node routing. This open-loop measurement network separates the data generation from the network data transmission, that is, the data generation is independent of the working state of the network. The experimental results show that compared with the traditional zxy routing algorithm, the thermally balanced 3D-TCNOC routing algorithm proposed in this paper can effectively reduce the maximum temperature of the system. At the same time, the temperature distribution is more balanced.
【学位授予单位】：西安电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN47

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