基于微小通道与冲击射流的电子器件冷却机理研究

发布时间：2018-03-23 01:31

本文选题：电子元器件散热　切入点：带射流微小通道　出处：《华中科技大学》2015年硕士论文　论文类型：学位论文

【摘要】：随着电子元器件的不断微型化发展,热源产生的热流密度显著增加,如果没有有效的散热方式,这些电子元器件将在过高的温度下工作,使用寿命和可靠性都显著降低。然而,传统的冷却方式常常不能满足这个需求,本文将针对微小通道和冲击射流这类新型冷却方式进行了研究。首先从理论上分析了微小通道和冲击射流以及两者相结合模型的流动换热原理。再采用数值模拟对比分析了微小通道和带射流微小通道的性能,结果表明:微小通道具有很好的换热性能,但与射流结合后能有效改善热沉温度的均匀性,进一步提升性能。对带射流微小通道热沉瞬态工况进行了数值模拟,分析了周期性变化的热流和射流速度对该热沉流动换热的影响。将热沉的被冷却壁面传热系数的周期平均值,温度均匀性作为评定冷却性能的参数。结果表明:周期性的热流和射流速度会对热沉的瞬态性能有显著的影响,造成不均匀性和瞬态变化的温度分布,产生热疲劳,从而影响使用寿命。为进一步提高带射流微小通道的冷却效果,设计了一种新的将喷嘴向微小通道中延伸的改进方案,通过数值模拟分析了模型对称面的速度、温度云图以及被冷却壁面的温度分布云图、平均温度,热沉的压降,Nu来对比研究喷嘴向微小通道中延伸不同尺寸时热沉的性能。结果表明:将喷嘴管壁向微小通道中延伸是一种能进一步提高带射流微小通道热沉换热性能的方法。
[Abstract]:With the continuous development of miniaturization of electronic components, the heat flux generated by heat sources increases significantly. Without effective heat dissipation, these electronic components will work at too high temperature, and their service life and reliability will be significantly reduced. Traditional cooling methods often fail to meet this demand. In this paper, a new cooling method such as micro-channel and impinging jet is studied. Firstly, the flow heat transfer principle of micro-channel and impinging jet and their combined model are theoretically analyzed. Then numerical simulation is used. The performances of micro channel and small channel with jet are compared and analyzed. The results show that the micro-channel has good heat transfer performance, but it can improve the uniformity of the heat sink temperature and further improve the performance after combining with the jet. The numerical simulation of the transient state of heat sink of the micro-channel with jet is carried out. The influence of periodically varying heat flux and jet velocity on the heat transfer of the heat sink flow is analyzed. The results show that the periodic heat flux and jet velocity have a significant effect on the transient performance of the heat sink, resulting in inhomogeneity and transient temperature distribution, resulting in thermal fatigue. In order to further improve the cooling effect of micro-channel with jet, a new scheme is designed to extend the nozzle into the micro-channel, and the velocity of the symmetric surface of the model is analyzed by numerical simulation. The temperature cloud map and the temperature distribution of the cooled wall, the average temperature, The pressure drop of heat sink is used to compare and study the heat sink performance of the nozzle extending into the micro channel with different dimensions. The results show that extending the nozzle wall into the micro channel is a method to further improve the heat transfer performance of the micro channel with jet.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN601

【相似文献】