当前位置:主页 > 科技论文 > 电子信息论文 >

3D组装面阵列垂直互连技术及可靠性

发布时间:2018-03-25 21:45

  本文选题:3D组装 切入点:毛纽扣 出处:《哈尔滨工业大学》2015年硕士论文


【摘要】:随着电子设备向着小型化、多功能的方向发展,在二维平面组装上已达到技术极限,人们将目光转向三维立体组装技术,三维立体组装可以提高封装密度,大幅度减少设备尺寸,提供更多的I/O端口,对于实现设备的小型化具有重要意义,成为目前组装技术研究的热点。本文将研究三维立体组装技术中的面阵列垂直互连技术。利用双面凸点转接板键和技术、毛纽扣垂直互连技术实现三层电路板的立体组装。首先研究了三种不同材料毛纽扣的力学和电学特性,之后利用重熔法制备可供立体组装使用的大尺寸焊球,并利用激光植球实现了转接板的制备。利用两种垂直互连方式实现了三层电路板的立体组装。并对其进行了高低温热冲击试验和随机振动试验。最后利用有限元模拟软件ANSYS模拟了三维立体组装电路在高低温热冲击和随机振动试验中的响应,找出了结构的薄弱环节。研究结果表明:毛纽扣的力学特性具有非线性的特点,弹性模量分为三个阶段分别对应毛纽扣在不同应变下金属丝的三种接触方式,得到了其力学模型。毛纽扣的电阻R和应变的倒数1/分两个阶段成线性关系。Au/Be Cu毛纽扣具有较好的弹性和抗振性,Au/Mo毛纽扣具有良好的高温稳定性,Au/Be Cu-Mo双丝复合毛纽扣兼备其他两种毛纽扣的特点。利用重熔法制备的大焊球,在较短的重熔时间下其内部组织较为细密,富铅相分布均匀,与原始焊球无明显差异。在热冲击试验后,转接板边角处的焊点最易发生失效,裂纹首先出现在靠近A、B电路板一侧,萌生在钎料基体靠近焊盘的位置,并平行于焊盘方向扩展。在振动试验中,小尺寸焊点的断裂位置在焊盘和PCB板之间,采用大尺寸焊球的三维组装电路未发生断裂。ANSYS有限元分析结果表明:在边角位置的焊点应力最大,最易失效,与试验结果一致。随机振动试验表明A层电路板最易发生共振,靠近A层电路板中心区域在转接板中间的焊点具有最大的加速度,但是在边角处的焊点具有最大的应力,是系统的薄弱环节。
[Abstract]:With the development of electronic equipment towards miniaturization and multi-function, the technology limit has been reached in two-dimensional plane assembly. People turn their attention to three-dimensional assembly technology, which can improve the packaging density. Greatly reducing the size of the device and providing more I / O ports is of great significance to the miniaturization of the device. In this paper, we will study the surface array vertical interconnection technology in three-dimensional assembly technology. The vertical interconnect technology of wool buttons is used to realize the three-dimensional assembly of three-layer circuit boards. Firstly, the mechanical and electrical properties of three different materials of wool buttons are studied, and then the large size solder balls for stereoscopic assembly are prepared by remelting method. The fabrication of the switch board was realized by using laser ball planting. The three-dimensional assembly of the three-layer circuit board was realized by two vertical interconnection methods. The thermal shock test and random vibration test were carried out at high and low temperature. Finally, the finite element method was used. The simulation software ANSYS simulates the response of three-dimensional assembly circuit to high and low temperature thermal shock and random vibration test. The results show that the mechanical properties of wool buttons are nonlinear, and the elastic modulus is divided into three stages corresponding to three contact modes of wool buttons under different strain. The mechanical model is obtained. The resistance R of hair button and the reciprocal of strain are linear in two stages. Au-be-Cu hair button has good elasticity and vibration resistance. Au-Mo button has good high temperature stability and high temperature stability. Features of two other types of hairy buttons. Large solder balls prepared by remelting, Under the short remelting time, the internal structure is finer, the lead-rich phase distribution is uniform, and there is no obvious difference from the original welding ball. After the thermal shock test, the solder joint at the edge corner of the plate is most likely to fail. The crack occurs at first near the side of the AZB circuit board and originates in the position of the solder matrix near the pad and extends parallel to the pad direction. In vibration tests, the fracture position of the small size solder is between the pad and the PCB plate. The results of finite element analysis show that the stress of solder joint at the edge angle is the largest and the most likely to fail, which is consistent with the test results. The random vibration test shows that the A layer circuit board is the most prone to resonance. The solder joint near the center of the A layer circuit board has the largest acceleration, but the solder joint at the edge corner has the biggest stress, which is the weak link of the system.
【学位授予单位】:哈尔滨工业大学
【学位级别】:硕士
【学位授予年份】:2015
【分类号】:TN05

【参考文献】

相关期刊论文 前2条

1 杨光育;杨建宇;韩依楠;;电子产品3D—立体组装技术[J];电子工艺技术;2008年01期

2 王玉菡;曹全喜;;3-D MCM封装技术及其应用[J];电子科技;2006年03期

相关硕士学位论文 前1条

1 房迅雷;微波立体组装技术研究[D];南京理工大学;2005年



本文编号:1665008

资料下载
论文发表

本文链接:https://www.wllwen.com/kejilunwen/dianzigongchenglunwen/1665008.html


Copyright(c)文论论文网All Rights Reserved | 网站地图 |

版权申明:资料由用户670b5***提供,本站仅收录摘要或目录,作者需要删除请E-mail邮箱bigeng88@qq.com