单晶硅微尺度侧磨表面质量影响因素试验研究
发布时间:2018-04-02 23:27
本文选题:微加工 切入点:微尺度磨削 出处:《东北大学学报(自然科学版)》2017年07期
【摘要】:为了获得具有较好表面质量的典型硬脆材料单晶硅微结构,采用微尺度磨削技术,利用直径为0.9 mm的微磨棒沿单晶硅(100)晶面进行磨削.首先通过三因素五水平的正交试验分析出影响单晶硅微尺度磨削表面粗糙度的主次因素;其次优化出获得较小表面粗糙度的单晶硅微尺度磨削工艺;最后通过单因素试验研究单晶硅微磨削表面粗糙度(Ra)随工艺参数的变化规律.结果表明:在沿单晶硅(100)晶面的微磨削过程(20 000 r/min≤v_s≤60 000 r/min,20μm/s≤v_w≤170μm/s和3μm≤a_p≤15μm)中,主轴转速对R_a影响最大;当主轴转速(v_s)为50 000 r/min、进给速度(v_w)为20μm/s、磨削深度(a_p)为3μm时,R_a最小;R_a随vs的增大基本呈减小趋势,但v_s过大时机床主轴出现振动,R_a出现增大趋势.R_a随v_w和a_p的增大而增大.
[Abstract]:In order to obtain the microstructures of typical hard and brittle materials with good surface quality, the micro-grinding technique was adopted, and the micro-grinding rod with a diameter of 0.9 mm was used to grinding along the crystal plane of the single crystal silicon (100).Firstly, the primary and secondary factors affecting the surface roughness of monocrystalline silicon micro-grinding are analyzed by orthogonal experiments of three factors and five levels, and then the micro-scale grinding process of single crystal silicon with smaller surface roughness is optimized.Finally, the variation of surface roughness with process parameters is studied by single factor experiment.褰撲富杞磋浆閫,
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