热容型大功率半导体激光器瞬态热特性
发布时间:2018-04-04 02:03
本文选题:激光器 切入点:半导体激光器 出处:《发光学报》2016年04期
【摘要】:为研究热容型大功率半导体激光器在低环境温度、高瞬时功率、长工作间歇时间条件下的应用,建立三维瞬态热传导模型,通过有限元法计算得出热沉三维尺寸对半导体激光器瞬态热特性的影响。选取尺寸为26.6 mm×11.5 mm×4 mm的热沉进行热容型半导体激光器的封装测试,获得其在-20℃和-30℃环境温度下连续工作3.5 s过程中有源区温度随时间的变化曲线,并与数值计算的结果进行对比。结果表明,两者在误差范围内能够很好地吻合。
[Abstract]:In order to study the application of high power semiconductor laser with heat capacity in low ambient temperature, high instantaneous power and long intermittent time, a three-dimensional transient heat conduction model was established.The effect of three dimensional heat sink on transient thermal characteristics of semiconductor laser is calculated by finite element method.The heat sink of 26.6 mm 脳 11.5 mm 脳 4 mm is selected to test the package of the heat capacitive semiconductor laser. The curves of the source temperature with time during the 3.5 s continuous operation at -20 鈩,
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