高功率半导体激光泵阀表面改性技术及设备研究

发布时间：2018-04-04 14:05

本文选题：高功率半导体激光器　切入点：泵阀表面改性　出处：《华中科技大学》2015年硕士论文

【摘要】：半导体激光器以其电光转换效率高、性能稳定、可靠性好、寿命长、体积小、重量轻及易于与机器手臂结合等优点开拓了许多传统激光器无法涉及的领域,在工业应用方面受到了国内外学者越来越多的关注。立足于浙江温州当地传统优势泵阀产业目前所面临的产业瓶颈,本文采用理论研究仿真和工艺实验探索验证的方法,从泵阀表面高功率半导体激光改性专用设备的设计,激光、粉末和基体之间的互相作用关系及温度场仿真,激光加工过程中的羽辉屏蔽效应,泵阀表面处理工艺参数的优化和应用过程中的现场缺陷分析及质量控制方法这几方面进行了系统的分析和研究,所完成的工作如下:(1)研究了泵阀行业中的各类加工对象,设计出了泵阀表面高功率半导体激光改性专用设备,并对3KW半导体激光器、光束整形、冷却系统、电源技术和五轴三联动加工系统进行了分析。(2)研究了泵阀表面处理过程中,激光、基体和粉末之间的相互作用关系,并以此建立了半导体激光表面改性温度场模型,对激光功率1KW,扫描速度5mm/s;激光功率2KW,扫描速度5mm/s;激光功率2KW,扫描速度10mm/s这三组工艺参数进行了仿真与分析,探索了激光功率、扫描速度对表面改性的影响。(3)采用数值模拟与实验研究相结合的方法,构建粒子密度数学模型和ABCD光学矩阵,从吸收和折射两方面对光斑尺寸为0.5mm*1mm的半导体激光进行羽辉屏蔽效应研究,发现在一定程度上,羽辉对激光的影响可等效于一个梯度折射率透镜,使其焦点下移,光斑尺寸变大,能量密度衰减最大可达90%以上。(4)通过人工神经网络算法对工艺参数进行了初步优化,且验证得激光功率为1.8KW,扫描速度为6mm/s时,阀板样品的表面硬度为378.8HV,与预测值基本相符,并对实验过程中的缺陷进行了分析,提出了相应的质量控制方法。
[Abstract]:Semiconductor lasers have many advantages such as high electro-optic conversion efficiency, stable performance, good reliability, long life, small volume, light weight and easy combination with robot arms.More and more scholars at home and abroad pay more and more attention to industrial application.Based on the bottleneck of the traditional advantage pump valve industry in Wenzhou, Zhejiang Province, this paper adopts the methods of theoretical research, simulation and technological experiment to explore and verify the design of the special equipment for high power semiconductor laser modification on the surface of the pump valve, laser,The interaction between powder and matrix, the simulation of temperature field, and the shielding effect of plume during laser processing.The optimization of pump valve surface treatment process parameters and the field defect analysis and quality control methods in the application process are systematically analyzed and studied. The work accomplished is as follows: 1) the various processing objects in the pump valve industry have been studied.The special equipment for high power semiconductor laser modification of pump valve surface is designed. The 3KW semiconductor laser, beam shaping, cooling system, power supply technology and five-axis three linkage machining system are analyzed.The relationship among laser, matrix and powder, and the temperature field model of semiconductor laser surface modification is established.The laser power of 1kW, scanning speed of 5mm / s, laser power of 2kW, scanning speed of 5mm / s, laser power of 2kW, scanning speed 10mm/s were simulated and analyzed, and the laser power was explored.The effect of scanning speed on surface modification. (3) the mathematical model of particle density and ABCD optical matrix are constructed by combining numerical simulation with experimental study.The plume shielding effect of semiconductor laser with spot size of 0.5mm*1mm is studied in terms of absorption and refraction. It is found that, to a certain extent, the effect of plume on laser is equivalent to that of a gradient index lens, which causes the focus to shift down.When the laser power is 1.8 kW and the scanning speed is 6mm/s, the process parameters are optimized by artificial neural network algorithm, the maximum attenuation of energy density is more than 90%.The surface hardness of the valve plate sample is 378.8 HVV, which is basically consistent with the predicted value. The defects in the experiment are analyzed and the corresponding quality control method is put forward.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN248.4

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