基于空冷式多孔微热沉的大功率LED阵列散热研究

发布时间：2018-04-10 07:43

  本文选题：大功率LED　切入点：多孔微热沉　出处：《湖南理工学院》2017年硕士论文

【摘要】：大功率LED(Light Emitting Diode)作为新一代半导体光源具有节能、环保、寿命长等优点而受到广泛的研究和关注。然而,由于LED受电光转换效率的限制,约有80%以上的功率转换成了热能,若不能及时有效地散出这些热量,将会导致热量积累造成结温升高,从而降低LED的寿命和发光效率,严重影响LED工作的稳定性。因此,散热问题是大功率LED器件应用推广急需解决的难题。针对大功率LED具有高热流密度、结温要求严格控制的特点,本文提出一种新型的空冷式多孔微热沉冷却技术来满足大功率LED阵列的散热需求。首先,根据多孔微热沉的结构建立多孔微热沉的数学模型和仿真计算模型。其次,使用流体仿真软件Fluent对空冷式多孔微热沉的大功率LED阵列进行热模拟,仿真结果表明:在环境温度为27℃、LED阵列输入功率为125W的情况下,LED芯片的最高温度为62℃。最后,采用仿真模拟的方法,对影响多孔微热沉流动与传热的因素展开分析,并得出以下结论:增大进口风速可以有效的降低LED芯片温度,但下降趋势逐渐减弱;减小孔隙率可以有效改善微热沉的散热效果,但会增大多孔微热沉的压降;减小多孔芯的厚度,LED芯片温度逐渐降低,且下降趋势逐渐增大;环境温度与LED芯片温度具有良好的线性关系;LED阵列输入功率与LED芯片温度也具有良好的线性关系。通过本文的研究工作可知,空冷多孔微热沉散热技术确实可以满足大功率LED阵列的散热需求,为大功率LED的应用提供了一种新型的散热方式。分析得到各影响因素对微热沉散热性能的影响规律,为多孔微热沉的结构优化设计提供理论依据。
[Abstract]:As a new generation of semiconductor light source, high-power LED(Light Emitting Diode has been widely studied and paid attention to because of its advantages of energy saving, environmental protection and long life.However, due to the limitation of electro-optic conversion efficiency, more than 80% of the power of LED is converted into heat energy. If the heat can not be dissipated in time and effectively, it will lead to heat accumulation and increase the junction temperature, thus reducing the lifetime and luminous efficiency of LED.Seriously affect the stability of LED work.Therefore, the problem of heat dissipation is an urgent problem to be solved in the application and popularization of high power LED devices.In view of the characteristics of high power LED with high heat flux and strict control of junction temperature, a new air-cooled porous micro-heat sink cooling technology is proposed to meet the heat dissipation requirements of high-power LED arrays.Firstly, the mathematical model and simulation model of porous micro-heat sink are established according to the structure of porous micro-heat sink.Secondly, the high-power air-cooled porous micro-heat sink LED array is simulated by the fluid simulation software Fluent. The simulation results show that the maximum temperature of the Fluent chip is 62 鈩，

本文编号：1730305