用响应和串音识别焦平面探测器相连缺陷元研究

发布时间：2018-04-13 21:17

本文选题：焦平面探测器 + 相连缺陷元　；参考：《红外与激光工程》2017年04期

【摘要】：采用高倍光学显微镜和焦平面探测器测试系统对焦平面探测器相连缺陷元进行了测试分析,研究了焦平面探测器相连缺陷元的成因。研究结果表明:借助高倍光学显微镜很难识别相连缺陷元;采用焦平面探测器响应测试系统进行测试时,相连缺陷元的响应电压与正常元基本相同,相连缺陷元无法被识别;采用焦平面探测器串音测试系统进行测试时,相连缺陷元之间串音为100%,明显不同于正常元,此时两元相连缺陷元响应电压是正常元响应电压的二分之一,相连缺陷元可以被有效识别。光刻腐蚀引入的台面或电极相连,以及光刻剥离引入的铟柱相连导致了缺陷元的产生;通过光刻腐蚀、剥离工艺优化,可以有效减少焦平面探测器相连缺陷元。
[Abstract]:The defect elements connected to focal plane detectors are tested and analyzed by using high-power optical microscope and focal plane detector testing system, and the causes of the connected defect elements of focal plane detectors are studied.The results show that it is difficult to identify the connected defect elements with the help of high-power optical microscope, and the response voltage of the connected defect elements is basically the same as that of the normal elements when the focal plane detector response test system is used.When using the focal plane detector crosstalk test system, the crosstalk between the connected defect elements is 100, which is obviously different from the normal element. At this time, the response voltage of the two-element connected defect element is 1/2 of the normal element response voltage.Linked defect elements can be effectively identified.The table or electrode connected by lithography and the indium column connected by lithography lead to the generation of defect elements. Through lithography etching and optimization of stripping process the defect elements connected with focal plane detectors can be effectively reduced.
【作者单位】：西北工业大学电子信息学院;中国空空导弹研究院;红外探测器技术航空科技重点实验室;
【基金】：航空创新基金(2011D01406)
【分类号】：TN215

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