SnAgCu无铅焊点的剪切数值模拟及实验研究

发布时间：2018-04-19 05:06

本文选题：SnAgCu + 剪切强度　；参考：《哈尔滨理工大学》2015年硕士论文

【摘要】：科学技术的发展推动着电子产品的不断升级，微电子封装技术在电子产业中起到的作用越来越大，BGA封装技术对促进电子器件微小化，节能化起到了很大的帮助。焊点作为BGA封装结构中的关键部位，起到了物理支撑、导电导热，传递信号的作用，其可靠性决定着电子产品的稳定性及使用寿命。焊点的剪切实验是用来评价焊点与基板结合强度的常用方法，对焊点的可靠性研究提供了一定的参考依据。本文通过有限元模拟及实验分析方法对SAC305/Cu焊点的剪切力学行为进行了研究。首先，利用有限元分析方法对SAC305/Cu焊点进行了不同剪切速度下的应力应变分析，分析剪切速度对焊点剪切强度的影响规律。其次，对SAC305/Cu焊点进行了不同剪切速度下的剪切实验，对比结果表明有限元分析方法得到的数据与实验得到的数据趋势大体相一致。再次，对SAC305/Cu焊点进行了在不同剪切高度下的有限元模拟及实验分析。然后，对不同直径条件下的SAC305/Cu焊点进行了有限元模拟分析，分析结果表明该焊点存在着一定的“尺寸效应”。运用有限元分析方法对SAC305/Cu焊点在不同IMC层厚度条件下进行了有限元模拟分析，分析结果表明IMC层对焊点的剪切力学性能有着很大的影响。本文对高低银SAC305/Cu和SAC0307/Cu进行了剪切实验及分析，得到在不同剪切速度下， SAC305/Cu焊点表现的剪切力学强度高于SAC0307/Cu焊点。在不同的剪切高度下做对比分析，得到SAC305/Cu焊点的剪切力学强度高于SAC0307/Cu焊点。对两种焊点在不同直径条件下的剪切强度做对比分析，，以及在焊点时效后IMC层的增长趋势分析中，得到SAC305/Cu焊点较SAC0307/Cu焊点的综合力学性能好。
[Abstract]:The development of science and technology promotes the upgrading of electronic products. The microelectronic packaging technology plays a more and more important role in the electronic industry. BGA packaging technology plays a great role in promoting the miniaturization and energy-saving of electronic devices.As a key part of BGA packaging structure, solder joint plays the role of physical support, conductive heat conduction and signal transfer. The reliability of solder joint determines the stability and service life of electronic products.The shear test of solder joint is a common method to evaluate the bonding strength between solder joint and substrate.In this paper, the shear mechanical behavior of SAC305/Cu solder joints is studied by finite element simulation and experimental analysis.Firstly, the stress and strain analysis of SAC305/Cu solder joints at different shear speeds is carried out by using finite element analysis method, and the influence of shear velocity on the shear strength of solder joints is analyzed.Secondly, the shear experiments of SAC305/Cu solder joints are carried out at different shear rates. The results show that the data obtained by the finite element method are in good agreement with the experimental data.Thirdly, finite element simulation and experimental analysis of SAC305/Cu solder joints at different shear heights are carried out.Then, the finite element analysis of SAC305/Cu solder joints with different diameters is carried out. The results show that the solder joints have a certain "size effect".The finite element analysis method is used to simulate the SAC305/Cu solder joints under different IMC layer thickness. The results show that the IMC layer has a great influence on the shear mechanical properties of the solder joints.In this paper, shear test and analysis of high and low silver SAC305/Cu and SAC0307/Cu are carried out. The results show that the shear mechanical strength of SAC305/Cu solder joints is higher than that of SAC0307/Cu solder joints at different shear rates.The shear mechanical strength of SAC305/Cu solder joint is higher than that of SAC0307/Cu solder joint.The shear strength of two kinds of solder joints under different diameter conditions was compared and the growth trend of IMC layer after solder joint aging was analyzed. It was found that the comprehensive mechanical properties of SAC305/Cu solder joint were better than that of SAC0307/Cu solder joint.
【学位授予单位】：哈尔滨理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN05

【共引文献】