绿色印刷布线技术和关键材料的研究

发布时间：2018-04-19 15:04

本文选题：印刷电子技术 + 导电银浆　；参考：《清华大学》2015年硕士论文

【摘要】：传统电子电路的布线技术主要基于减成法工艺,即覆铜板刻蚀工艺,其特点是工艺步骤复杂、能耗高、成本高以及环境污染严重等。此外,基于树脂玻纤板的电路板垃圾由于量大、回收利用价值低,往往被运往发展中国家的沿海落后地区被野蛮拆解焚烧;由于缺乏有效的监管,造成当地严重的污染问题,如臭名昭著的广东贵屿镇。要解决上述问题,最根本的办法是彻底颠覆当前覆铜板湿法刻蚀技术,采用更加廉价、环保和有效的新技术。正因如此,基于加成法------特别是加成法-干法工艺的印刷电子技术正越来越受到科研工作者和产业界的重视,针对印刷电子技术以及其相关印刷材料的研究和应用在近年来不断涌现出来。然而,在印刷电路板领域,尤其是多层印刷电路板,由于其结构相对复杂,仍然存在一系列的科学和工艺问题有待解决,亟需开发高性能的加成法印刷导电材料以及新型的高精度层间互连技术。本文在对高性能导电银浆研究的基础上,以普通打印纸作为基材模型,通过开发一系列的工艺设计以及材料配方,提出了一套面向未来绿色环保纸质印刷多层电路板的制备技术路线;良好解决了层间互连技术的难题,降低了导电银浆的成本,成功开发出了基于普通打印纸的多层电路板(最多可达10层)模型的制作技术。通过对其各方面性能的测试和评价,证明了本文所制备的纸质多层电路板在性能上基本符合电路板产业国际IPC标准的要求,并且在未来规模制造时具有明显的成本优势。同时,针对未来可能的绿色环保纸质印刷电路板技术的发展方向,本文也提出了新的思路。此外,本文通过生命周期分析(LCA)的方法,首次定量地研究和分析了纸质印刷电路板技术在生个生命周期过程中造成的环境影响,通过与传统环氧电路板进行对比,发现本文开创的纸质印刷电路板技术在环境保护的方面与传统技术相比具有高达两个数量级的优势。由此,本文系统论证了纸质印刷电路板技术在制备技术、性能和环境保护等各方面的特点和优势。通过制备基于纸质印刷电路板的电子器件原型机,论证了该技术在低频、低密度、低成本以及短寿命的中低端电子器件领域可能的应用潜力。此外,本文针对导电银浆技术在高功率、高密度的电子电路应用领域存在的局限性,基于加成法工艺开创了一种锌种子浆料以及与其相关的置换高性能铜布线的技术方法。通过对锌浆料和置换铜溶液配方的研究和开发,成功制备了具有纯铜级别导电性的铜电子电路,可通过加成法印刷制作在聚酯薄膜、聚酰亚胺薄膜和玻璃等各种廉价的基材表面。通过一系列的测试和分析,本文进一步证明了该铜布线技术制得的电子电路具有良好的机械性能和可靠的使用性能,各项性能指标可与目前商用印制线路板性能媲美。可应用在常规商用柔性线路板、射频识别标签等元器件中,在高功率、高密度以及高性能电子电路产品领域具有广泛的应用潜力。通过对纸质印刷电路板技术、高性能铜布线技术以及相关材料的开创性研究,本文分别从印刷布线技术和材料两方面入手,针对当前学术界和产业界所关心的印刷电子技术的难点,提出了更加环保、廉价和有效的解决方案,并且通过具体的实验设计和测试分析,论证了本文提出的方案相对于当前技术的特点和优势。此外,本文还从产业应用的角度出发,通过制备相应的模型说明了本文所提出的材料和技术方案在未来绿色印刷电子产业中的应用前景和优势。
[Abstract]:The wiring technology of traditional electronic circuits is mainly based on the process of subtraction, that is, copper clad etching process, which is characterized by complex process, high energy consumption, high cost and serious environmental pollution. In addition, the circuit board waste based on resin glass fiber board has a large amount of waste and low recycling value, which is often transported to the backward coastal areas of developing countries. Barbarous dismantling and incineration; the lack of effective supervision, causing serious local pollution problems, such as the notorious Guangdong Guiyu town. The most fundamental way to solve the above problems is to completely subvert the current copper plate wet etching technology and adopt a cheaper, environmentally friendly and effective new technology. The printing electronic technology of the process of the law and the dry process is being paid more and more attention by the researchers and industry circles. The research and application of printed electronic technology and its related printing materials have emerged in recent years. However, in the field of printed circuit board, especially the multilayer printed circuit board, because of its relatively complex structure, it still exists. A series of scientific and technological problems need to be solved. It is urgent to develop high performance printed conductive materials and new high precision interlayer interconnect technology. In this paper, based on the research of high performance conductive silver pulp, the common print paper is used as the base material model, and a set of process design and material formula is developed. The technical route for the preparation of the future green paper printing multilayer circuit board is to solve the difficult problem of interlayer interconnect technology and reduce the cost of the conductive silver pulp. The production technology of the multilayer circuit board based on ordinary printing paper (up to 10 layers) is successfully developed. The performance of this paper is basically in line with the requirements of the international IPC standard of the PCB industry, and has obvious cost advantages in the future scale manufacturing. At the same time, new ideas have been put forward to the future possible development direction of the possible green paper printed circuit board technology. The method of life cycle analysis (LCA) is the first time to study and analyze the environmental impact caused by paper printed circuit board technology in the life cycle. By comparing with the traditional epoxy board, it is found that the paper printed circuit board technology in this paper has two higher than traditional technology in environmental protection. Therefore, this paper systematically demonstrates the characteristics and advantages of paper printed circuit board technology in various aspects of preparation technology, performance and environmental protection. By making electronic device prototypes based on paper printed circuit boards, the technology is demonstrated in the low frequency, low density, low cost and short life medium and low end electronic devices. In addition, in view of the limitations of the application of conductive silver pulp technology in high power, high density electronic circuits, a zinc seed slurry and its related replacement high performance copper wiring technology are created based on the addition process. The research and development of zinc slurry and replacement copper solution formula are studied. The copper electronic circuits with pure copper grade conductivity have been successfully prepared, which can be printed on a variety of cheap substrates, such as polyester film, polyimide film and glass, and so on. Through a series of tests and analyses, this paper further proves that the electronic circuit made by the copper wiring technology has good mechanical properties and reliability. It can be used in conventional commercial flexible PCB, RFID tags and other components, and has wide application potential in high power, high density and high-performance electronic circuit products. Through the paper printed circuit board technology, high performance copper wiring From the two aspects of the printing and wiring technology and the material, this paper puts forward a more environmentally friendly, inexpensive and effective solution to the difficulties of the printing and electronic technology concerned in the academic and industrial circles, and demonstrates this paper by specific experimental design and test analysis. Compared with the characteristics and advantages of the current technology, this paper also describes the application prospects and advantages of the proposed materials and technical schemes in the future green printing electronics industry from the perspective of industrial application.

【学位授予单位】：清华大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405

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