现场总线MAU芯片中的电源及发送电路的设计与研究

发布时间：2018-04-24 04:37

本文选题：现场总线 + 介质结合单元　；参考：《沈阳工业大学》2015年硕士论文

【摘要】：论文研究基于国内工艺的现场总线介质结合单元（MAU）芯片设计技术。现场总线是自动控制领域的先进技术，现场总线仪表较常规仪表有许多显著的优点。介质结合单元（MAU）电路是现场总线仪表中的关键部件，用于实现内部逻辑信号与总线信号的相互转换，总线供电型现场总线仪表的MAU电路还负责从总线上吸取电流，为系统提供稳定的工作电源。MAU电路是现场总线仪表的设计难点，目前只有少数国外公司能提供专用芯片，课题的研究对于提高国产现场总线仪表的竞争力有重要意义。论文首先介绍了现场总线的发展状况和国际标准，重点介绍了和分析了采用IEC61158-2低速现场总线标准的现场总线仪表的通信机制和信号传输原理，分析了MAU电路的功能和性能要求。在此基础上，介绍了一种国外公司生产的典型MAU芯片，该芯片是一种大规模混合信号集成电路，使用少量外部元件即可实现MAU电路功能。为深入理解MAU电路的工作原理和设计方法，首先对该款芯片进行了逆向分析，提取并整理了电路，并对该电路的工作原理和工艺要求进行了深入分析。由于国内没有与原芯片兼容的工艺，，故采用了正向与逆向结合的设计方法，基于HHNEC0.35μm BCD工艺重新设计了一种与原芯片功能兼容的MAU芯片。设计中保留了部分原有电路结构，但对许多电路模块做了较大修改，部分模块完全是重新设计的。论文具体介绍了其中启动模块、恒流模块、电源模块和发送成型模块等功能模块的电路设计、仿真验证和版图设计工作。设计中充分利用现有工艺的优势，简化了一些功能的实现方式，减小了版图面积。论文中给出了详细的仿真分析结果，结果表明所设计的MAU芯片在功能上与原芯片兼容，各项性能指标均不低于原芯片水平。论文中给出了相关模块的版图和整体版图，版图设计通过了DRC和LVS验证。
[Abstract]:This paper studies the design technology of fieldbus dielectric combination Unit (mau) chip based on domestic technology. Fieldbus is an advanced technology in the field of automatic control. Fieldbus instruments have many advantages over conventional instruments. The dielectric combination Unit (Mau) circuit is the key component in the fieldbus instrument, which is used to realize the interconversion between the internal logic signal and the bus signal. The MAU circuit of the bus-powered fieldbus instrument is also responsible for absorbing the current from the bus. It is difficult to design fieldbus instrument to provide stable working power supply. At present, only a few foreign companies can provide special chip. The research on this topic is of great significance to improve the competitiveness of domestic fieldbus instruments. Firstly, this paper introduces the development of fieldbus and international standards, especially introduces and analyzes the communication mechanism and signal transmission principle of fieldbus instrument based on IEC61158-2 low speed fieldbus standard, and analyzes the function and performance requirements of MAU circuit. On this basis, a typical MAU chip produced by foreign companies is introduced. The chip is a large scale mixed signal integrated circuit, which can realize the function of MAU circuit with a few external components. In order to understand the working principle and design method of the MAU circuit, the reverse analysis of the chip is carried out, the circuit is extracted and sorted out, and the working principle and technological requirements of the circuit are analyzed. Because there is no compatible technology with the original chip in our country, a new MAU chip which is compatible with the original chip is designed based on the HHNEC0.35 渭 m BCD process. Part of the original circuit structure has been retained in the design, but many circuit modules have been greatly modified, and some of the modules have been completely redesigned. This paper introduces the circuit design, simulation verification and layout design of the function modules, such as startup module, constant current module, power supply module and transmission molding module. In the design, the advantages of the existing technology are fully utilized to simplify the realization of some functions and reduce the layout area. The detailed simulation results show that the designed MAU chip is compatible with the original chip in function and the performance index is not lower than that of the original chip. The layout and overall layout of the related modules are given in this paper. The layout design is verified by DRC and LVS.
【学位授予单位】：沈阳工业大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN402

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