基于InPb合金的非制冷焦平面探测器窗口低温焊接工艺研究

发布时间：2018-04-24 16:43

  本文选题：InPb焊料 + 非制冷焦平面探测器　； 参考：《红外技术》2017年07期

【摘要】：研究了采用纯度为99.9%的In70Pb30合金作为焊料片的低温焊接技术,分析了焊接时候的影响因素:焊料片的影响、升温速率、焊接温度、真空度,通过采用甲酸对焊料片预处理去除氧化层,在215℃、5×10~(-7) torr的真空环境下进行了焊接,焊接后的样品采用X-ray、拉力测试系统、检漏仪测试了样品的孔洞率、焊接强度、漏率,结果表明:焊接后焊接区域合金均匀、无缝隙、孔洞率少、剪切力高、气密性好,能够满足非制冷焦平面的窗口封接的气密性要求。
[Abstract]:The low temperature welding technology of In70Pb30 alloy with 99.9% purity as solder was studied. The influence factors of welding time, such as the influence of solder, heating rate, welding temperature, vacuum degree, were analyzed. The oxidation layer was removed by pretreating the solder sheet with formic acid, and the welding was carried out in a vacuum environment of 215 鈩，

本文编号：1797463