植入式柔性神经微电极纳米改性研究

发布时间：2018-04-27 15:47

本文选题：柔性神经微电极 + Parylene　；参考：《石家庄铁道大学》2015年硕士论文

【摘要】：植入式微系统正在被广泛应用于诸多领域,例如:脑-机接口(Brain-Machine Interface,BCI)和神经假体等。通过它们的帮助人们可以更加深入地了解神经系统,治疗神经性疾病。植入式神经微电极是外部电子系统与神经系统连接的关键器件,随着神经科学研究和医疗需求的发展,植入式微电极的应用越来越广泛,对电极性能的要求也越来越高。本文主要工作集中在植入式柔性神经微电极的一致性及其改性研究。本文进行了基于普通硅片的不同规格的柔性神经微电极设计、制作、封装以及电学性能测试;研究了氧反应离子刻蚀Parylene衬底表面以增强Parylene衬底和器件金属膜层之间粘附性能的刻蚀工艺;研究了基于普通硅片的一致性好的柔性神经微电极的电学性能的改进。本文主要的研究成果和创新点如下:根据动物实验需求,设计了7种不同规格的柔性神经微电极。根据本研究小组开发的基于硅片的工艺特点,实现了在单片4英寸片完成普通硅片上500多个柔性神经微电极的工艺版图设计,实现了柔性神经微电极工程制备的能效最优化。通过氧反应离子刻蚀对柔性神经微电极中柔性衬底Parylene薄膜和金属层薄膜的粘附性能进行改善。研究了与柔性神经微电极制备工艺兼容的、具有批量化修饰能力的氧反应离子刻蚀方法,通过对氧反应离子刻蚀的压强、氧气流量和刻蚀时间参数的实验研究,通过百格法的粘附性能测试,得到了可使Parylene薄膜和金属层薄膜增强的干刻条件,实现了柔性神经微电极的产品化。对所制备的柔性神经微电极进行了适合工程化制备的电学改性方法研究。将氧反应离子刻蚀的工艺方法应用于柔性神经微电极的制备过程中,通过对氧反应离子刻蚀参数的实验研究,得到了可使电极阻抗降低20倍的氧反应离子刻蚀条件,提高了电极的一致性,并改进了柔性神经微电极的电学性能。
[Abstract]:Implantable microsystems are widely used in many fields, such as Brain-Machine Interface (BCII) and neuroprosthesis. Through their help people can better understand the nervous system, the treatment of neurological diseases. Implantable neural microelectrode is the key device to connect the external electronic system with the nervous system. With the development of neuroscience and medical needs, the implanted microelectrode is more and more widely used, and the performance of the electrode is required more and more. This paper focuses on the consistency and modification of implanted flexible neural microelectrodes. In this paper, the design, fabrication, encapsulation and electrical performance testing of flexible neural microelectrodes with different specifications based on common silicon wafers are carried out. The etching process of oxygen reactive ion etching on the surface of Parylene substrate to enhance the adhesion between Parylene substrate and metal film was studied, and the improvement of electrical properties of flexible neural microelectrode based on common silicon wafer was studied. The main achievements and innovations of this paper are as follows: according to animal experimental requirements, seven kinds of flexible neural microelectrodes with different specifications have been designed. According to the technological characteristics of silicon wafer developed by this research group, the process layout design of 500 flexible neural microelectrodes on a single 4 inch wafer is realized, and the energy efficiency optimization of the fabrication of flexible neural microelectrode is realized. The adhesion properties of flexible substrates Parylene thin films and metal layer films in flexible neural microelectrode were improved by oxygen reactive ion etching. The oxygen reactive ion etching method, which is compatible with the preparation process of flexible neural microelectrode and has the ability of mass modification, is studied. The experimental study on the pressure, oxygen flow rate and etching time parameters of oxygen reactive ion etching is carried out. The dry etching conditions of Parylene thin film and metal layer film were obtained by testing the adhesive properties of the bounding method, and the production of flexible neural microelectrode was realized. The electrical modification method suitable for engineering preparation of the flexible neural microelectrode was studied. The process of oxygen reactive ion etching was applied to the preparation of flexible neural microelectrode. Through the experimental study of oxygen reactive ion etching parameters, the oxygen reactive ion etching condition was obtained, which can reduce the electrode impedance by 20 times. The uniformity of the electrode and the electrical properties of the flexible neural microelectrode are improved.
【学位授予单位】：石家庄铁道大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN305.7

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