整片晶圆纳米压印关键技术的研究

发布时间：2018-05-09 01:17

本文选题：晶圆纳米压印 + 揭开式脱模　；参考：《青岛理工大学》2015年硕士论文

【摘要】：整片晶圆纳米压印是一种大面积纳米压印图形化方法,在发光二极管、晶圆级光学器件、太阳能电池板具有广泛的应用。针对LED纳米图形化面临的问题,整片晶圆纳米压印的研究是非常重要的。但是目前整片晶圆纳米压印在脱模和模板制作等关键技术上存在问题,亟待解决。本项目针对脱模和模板制作这两个核心问题进行初步的研究。由于传统的脱模方式产生的脱模力较大,本文采用揭开式脱模的方式。首先对脱模过程进行理论分析,在脱模过程中涉及到固-固界面的相互作用,存在粘附力。因此,应用接触力学理论分析了几种接触理论以及接触理论模型。另外脱模过程中将导致模具产生缺陷,因此应用断裂力学对脱模过程中的应力和应变进行分析,为脱模过程的数值模拟奠定理论基础。其次对脱模过程进行数值模拟时,本文采用揭开式脱模的几何模型。用ABAQUS有限元软件对揭开式脱模进行数值模拟,分别对不同位移载荷、深宽比、图形层周期长度、材料、角度进行数值模拟,得到一定的结论。传统的模具结构无法满足LED纳米图形化大规模制造的需求,本文对模具进行了改进,创造性的提出了一种基于复合软模具的整片晶圆级纳米压印新方法。因此,本文设计了两套模板复制的装置,并介绍其工作原理,两套装置都能够独立的完成复合软模具的生产。
[Abstract]:The whole wafer nano-imprint is a large area nano-imprint graphic method. It is widely used in light-emitting diodes, wafer optical devices and solar panels. It is very important to study the whole wafer nano-imprint for the problem of LED nano-graphics. However, at present, there are some problems in the key technologies, such as demoulding and template making, which are urgent to be solved. This project carries on the preliminary research to the two core problems of demoulding and template making. Because of the high demoulding force produced by the traditional demoulding method, this paper adopts the method of unlocking the mould. Firstly, the theoretical analysis of the demoulding process is carried out. The solid-solid interface interaction is involved in the process of demoulding, and the adhesion force exists. Therefore, several contact theories and contact theory models are analyzed by means of contact mechanics theory. In addition, the mold defects will be produced in the process of demoulding, so the stress and strain in the process of demoulding are analyzed by fracture mechanics, which lays a theoretical foundation for the numerical simulation of the demoulding process. Secondly, in the numerical simulation of the demoulding process, the geometric model of the open demoulding is adopted in this paper. The ABAQUS finite element software is used to simulate the open demoulding. The different displacement load, the aspect ratio, the cycle length of the graphic layer, the material and the angle are simulated respectively, and some conclusions are obtained. The traditional die structure can not meet the needs of LED nano-graphics large-scale manufacturing. In this paper, we improve the mold and creatively propose a new method of wafer nano-imprint based on composite soft mold. Therefore, this paper designed two sets of template copying device, and introduced its working principle, the two sets of devices can independently complete the production of composite soft die.
【学位授予单位】：青岛理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN312.8

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